Electrochemical migration of electronic components at sea environments - characterizations and solutions
Hussain, M.A., Khoshnaw, F.M.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Glass Multilayer Lamination for PCB Manufacture using Pressure Assisted Low Temperature Bonding
Khoshnaw, F.M., Conway, L.P.P., Hutt, D.A., Williams, K.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Get full text
Conference Proceeding