Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC)
Chua, Lin Xiao, Woo, Hui Qin, Yong, Khai Seen, Li, Wu-Hu, Tan, Lay Poh, Gan, Chee Lip
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
The impact of high glass transition temperature of molding compounds on power package warpage and stress performance
Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding