Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface
Shin, Taein, Park, Hyunwook, Kim, Keunwoo, Kim, Seongguk, Son, Keeyoung, Son, Kyungjune, Park, Gapyeol, Park, Joonsang, Choi, Seonguk, Kim, Joungho
Published in 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (13.12.2021)
Published in 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (13.12.2021)
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Conference Proceeding
SI/PI Co-Design of 12.8 Gbps HBM I/O Interface using Bayesian Optimization for PSIJ Reduction
Shin, Taein, Park, Hyunwook, Lho, Daehwan, Kim, Keunwoo, Sim, Boogyo, Kim, Seongguk, Kim, Jihun, Choi, Seonguk, Yoon, Jiwon, Song, Jinwook, Chun, Sunghoon, Kim, Joungho
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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Conference Proceeding
Power Supply Induced Jitter (PSIJ) Modeling, Analysis, and Optimization of High Bandwidth Memory (HBM) I/O Interface
Park, Hyunwook, Shin, Taein, Kim, Seongguk, Son, Keeyoung, Kim, Keunwoo, Sim, Boogyo, Kang, Hyungmin, Choi, Seonguk, Yoon, Jiwon, Kim, Hyunwoo, Hwang, Chulsoon, Kim, Joungho
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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Conference Proceeding
Signal Integrity Analysis of High Speed Channel considering Thermal Distribution
Son, Keeyoung, Kim, Seongguk, Kim, Minsu, Lho, Daehwan, Kim, Keunwoo, Park, Hyunwook, Park, Gapyeol, Kim, Joungho
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Modeling and analysis of gate leakage in ultra-thin oxide sub-50nm double gate devices and circuits
Mukhopadhyay, S., Keunwoo Kim, Jae-Joon Kim, Shih-Hsien Lo, Joshi, R.V., Ching-Te Chuang, Roy, K.
Published in Sixth international symposium on quality electronic design (isqed'05) (2005)
Published in Sixth international symposium on quality electronic design (isqed'05) (2005)
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Conference Proceeding
A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)
Son, Keeyoung, Kim, Subin, Park, Hyunwook, Kim, Seongguk, Kim, Keunwoo, Park, Shinyoung, Sim, Boogyo, Jeong, Seungtaek, Park, Gapyeol, Kim, Joungho
Published in 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) (07.12.2020)
Published in 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) (07.12.2020)
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Conference Proceeding
Display device including substrate with polymeric films
Lee, Jaeseob, Kang, Taewook, Shin, Jiyeong, Kwak, Hyena, Kim, Keunwoo
Year of Publication 12.09.2023
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Year of Publication 12.09.2023
Patent
Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity
Lho, Daehwan, Park, Hyunwook, Kim, Keunwoo, Kim, Seongguk, Sim, Boogyo, Son, Kyungjune, Son, Keeyoung, Kim, Jihun, Choi, Seonguk, Park, Joonsang, Kim, Haeyeon, Kong, Kyubong, Kim, Joungho
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
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Conference Proceeding
Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module
Kim, Hyunwoo, Kim, Haeyeon, Park, Joonsang, Son, Keeyoung, Park, Hyunwook, Shin, Taein, Kim, Keunwoo, Yoon, Jiwon, Lee, Junghyun, Hong, Jonghyun, Kim, Juneyoung, Kim, Joungho
Published in 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (12.12.2022)
Published in 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (12.12.2022)
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Conference Proceeding
Performance assessment of scaled strained-Si channel-on-insulator (SSOI) CMOS
KIM, Keunwoo, CHUANG, Ching-Te, RIM, Kern, JOSHI, Rajiv V
Published in 2002 IEEE International SOI Conference (2002)
Published in 2002 IEEE International SOI Conference (2002)
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Conference Proceeding
Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network
Park, Hyunwook, Kim, Minsu, Kim, Subin, Jeong, Seungtaek, Kim, Seongguk, Kang, Hyungmin, Kim, Keunwoo, Son, Keeyoung, Park, Gapyeol, Son, Kyungjune, Shin, Taein, Kim, Joungho
Published in 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (14.12.2020)
Published in 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (14.12.2020)
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Conference Proceeding
Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM)
Kim, Hyunwoong, Kim, Jongwook, Song, Kyunghwan, Lee, Seonghi, Kim, Keunwoo, Kim, Seongguk, Lho, Daehwan, Kim, Hyunsik, Park, Minho, Ahn, Seungyoung
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning
Son, Kyungjune, Kim, Keunwoo, Park, Gapyeol, Lho, Daehwan, Park, Hyunwook, Sim, Boogyo, Shin, Taein, Park, Joonsang, Kim, Haeyeon, Kim, Joungho, Gong, Kyubong
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
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Conference Proceeding
A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling
Kim, Keunwoo, Lee, Junghyun, Hong, Seokwoo, Kim, Hyunwoo, Sim, Boogyo, Son, Kyungjune, Shin, Taein, Son, Keeyoung, Kim, Jinyoung, Kong, Kyubong, Kim, Joungho
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
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Conference Proceeding
Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface
Sim, Boogyo, Kim, Keunwoo, Shin, Taein, Park, Hyunwook, Kim, Seongguk, Lho, Daehwan, Son, Keeyoung, Kong, Kyubong, Jeong, Seungtaek, Choi, Seonguk, Kim, Jihun, Kim, Joungho
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
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Conference Proceeding
Transformer Network-based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)
Park, Hyunwook, Kim, Minsu, Kim, Seongguk, Kim, Keunwoo, Kim, Haeyeon, Shin, Taein, Son, Keeyoung, Sim, Boogyo, Kim, Subin, Jeong, Seungtaek, Hwang, Chulsoon, Kim, Joungho
Published in arXiv.org (23.08.2022)
Published in arXiv.org (23.08.2022)
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Paper
Journal Article