Diagnostics of the technological characteristics of high–power transistors using relaxation impedance spectrometry of thermal processes
Vaskou, A. S., Niss, V. S., Kononenko, V. K., Turtsevich, A. S., Rubtsevich, I. I., Solov’ev, Ya. A., Kerentsev, A. F.
Published in Russian microelectronics (01.12.2015)
Published in Russian microelectronics (01.12.2015)
Get full text
Journal Article
MONITORING OF IC ENCAPSULATION PROCESS
V. A. Saladukha, V. S. Turtsevitch, J. A. Solovjov, I. I. Rubtsevitch, A. F. Kerentsev, A. A. Dovzhenko, I. V. Chirko
Published in Pribory i metody izmererij (01.03.2015)
Get full text
Published in Pribory i metody izmererij (01.03.2015)
Journal Article
Increase stability D-Pak package transistors to thermal loadings
Kerentsev, A.F., Lanin, V.L., Anufriev, D.L.
Published in 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (01.06.2005)
Published in 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (01.06.2005)
Get full text
Conference Proceeding