Screening of active compounds as neuromedin U2 receptor agonist from natural products
Zheng, Xuxu, Hu, Yinghe, Liu, Jianhui, Ouyang, Keqing
Published in Bioorganic & medicinal chemistry letters (15.10.2005)
Published in Bioorganic & medicinal chemistry letters (15.10.2005)
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Journal Article
Generation of a bioactive neuropeptide in a cell-free system
Jiang, Cecilia, Chen, Guifen, Zeng, Xuemei, Ouyang, Keqing, Hu, Yinghe
Published in Analytical biochemistry (01.05.2003)
Published in Analytical biochemistry (01.05.2003)
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Journal Article
A 26-GHz Linear Power Amplifier with 20.8-dBm OP1dB Supporting 256-QAM Wideband 5G NR OFDM for 5G Base Station Equipment
Chen, Zhilin, Wang, Xiyu, Ma, Xiaoxiao, Lu, Min, Hu, Jie, Ouyang, Keqing, Long, Zhijun
Published in 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (11.06.2023)
Published in 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (11.06.2023)
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Conference Proceeding
Utilizing Macroscopic Polarization for Effective Fe3+/Fe2+ Cycling and H2O2 Activation in Fenton-like Aniline Aerofloat Degradation
Tu, Shuchen, Hao, Tianyang, Li, Xiangming, Chen, Tao, Wang, Yaqing, Zhang, Junhao, Zhou, Chengyu, Kuang, Linghui, Xu, Peng, Zeng, Yuan, Ouyang, Keqing, Jiang, Shaojun, Yan, Bo
Published in ACS ES&T engineering (12.07.2024)
Published in ACS ES&T engineering (12.07.2024)
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Journal Article
Utilizing Macroscopic Polarization for Effective Fe 3+ /Fe 2+ Cycling and H 2 O 2 Activation in Fenton-like Aniline Aerofloat Degradation
Tu, Shuchen, Hao, Tianyang, Li, Xiangming, Chen, Tao, Wang, Yaqing, Zhang, Junhao, Zhou, Chengyu, Kuang, Linghui, Xu, Peng, Zeng, Yuan, Ouyang, Keqing, Jiang, Shaojun, Yan, Bo
Published in ACS ES&T engineering (12.07.2024)
Published in ACS ES&T engineering (12.07.2024)
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Journal Article
An Efficient External Memory Test Solution: Case Study for HPC Application
Ouyang, Keqing, Peng, Minqiang, Zhu, Yunnong, Qi, Kang, Tshagharyan, Grigor, Kumar, Arun, Harutyunyan, Gurgen, Wang, Isaac
Published in 2023 IEEE 41st VLSI Test Symposium (VTS) (24.04.2023)
Published in 2023 IEEE 41st VLSI Test Symposium (VTS) (24.04.2023)
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Conference Proceeding
A Dynamic Reusable Structure of I/O Pads for Scan Chains
Peng, Minqiang, Ouyang, Keqing, Cheng, Qi, Zhou, Guohua, Chen, Lei
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
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Conference Proceeding
Comparison of Simulation and Test Results of Multi-Type Ring Oscillators on Advanced Process Nodes
Chen, Kuili, Wang, Jian, Wang, Haiyong, Ouyang, Keqing, Zhou, Guohua
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
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Conference Proceeding
Mirroring ATPG Technology for Multi-Core Chips
Ouyang, Keqing, Peng, Minqiang, Zhou, Jitong, Zhou, Guohua, Wu, Youfa
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
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Conference Proceeding
Tanshinone II-A Induced Apoptosis of HepG2: Involvement of p53, Bcl-2 and Bax
Pingqing Wang, Zhizhong Li, Keqing Ouyang, Zhihui Qin, Xi He, Ruicai Long, Yan Yan
Published in 2009 3rd International Conference on Bioinformatics and Biomedical Engineering (01.06.2009)
Published in 2009 3rd International Conference on Bioinformatics and Biomedical Engineering (01.06.2009)
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Conference Proceeding
A Methdology for Testing Scan Chain with Diagnostic Enhanced Structure
Ouyang, Keqing, Peng, Minqiang, Wang, Shuai, Zhou, Guohua, Wang, Kai
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
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Conference Proceeding
A Novel Method to Achieve High Efficient Iteration of MBIST Pattern
Peng, Minqiang, Ouyang, Keqing, Pan, Feilong, Zhou, Guohua, Chen, Lei
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
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Conference Proceeding
An Efficient ATPG Technology Based On Time Division Multiplexing Method
Peng, Minqiang, Ouyang, Keqing, Zhou, Lunmao, Zhou, Guohua
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
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Conference Proceeding
ESD Verification of a 2.5D CoWoS Package Design
Cao, Sen, Wu, Chenfei, Zhou, Guohua, Ouyang, Keqing, Yan, Quan
Published in 2022 International EOS/ESD Symposium on Design and System (IEDS) (09.11.2022)
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Published in 2022 International EOS/ESD Symposium on Design and System (IEDS) (09.11.2022)
Conference Proceeding
A Closed-Loop Chip Fast Binning Technology
Peng, Minqiang, Ouyang, Keqing, Wang, Jiawei, Chen, Xiwu, Zhou, Guohua, Chen, Lei
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
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Conference Proceeding
A Modularized Thermal Test Chip Design and Verification
Sun, Jianjun, Wang, Deping, Zhou, Shiying, Yan, Bin, Xie, Yelei, Pang, Jian, Li, Guangyao, Ouyang, Keqing
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
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Conference Proceeding
Machine Learning Based Aging Critical Path Selection
Ouyang, Keqing, Yao, Jiadong, Wei, Qi, Wu, Chenfei, Zhou, Guohua
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
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Conference Proceeding
Thermal Resistance Simulation Analysis and Test Research of Wire Bond Ball Grid Array Package
Qu, Fang, Yan, Bin, Wang, Zongwei, Tian, Zhongxuan, Pang, Jian, Li, Guangyao, Hu, Xuequan, Ouyang, Keqing
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
A crosstalk mitigation method of DDR5 in large size LGA package
Ouyang, Keqing, Ma, Shineng, Wu, Feng, Lei, Chao, Zhang, Jiangtao, Pang, Jian
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Solution to Optimize Warpage performance for 2.5D Fanout Packaging
Jiang, Yue, Chen, Yang, Hu, Fengtian, Han, Dong, Fang, Jianmin, Li, Guangyao, Ouyang, Keqing
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding