Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging
Lianto, Prayudi, Tan, Chin Wei, Jie Peng, Qi, Jumat, Abdul Hakim, Dai, Xundong, Peter Fung, Khai Mum, Huei See, Guan, Chong, Ser Choong, Wee David Ho, Soon, Serine Soh, Siew Boon, Huang Sharon Lim, Seow, Calvin Chua, Hung Ming, Abdillah Haron, Ahmad, Kenneth Lee, Huan Ching, Zhang, Mingsheng, Ko, Zhi Hao, Ko San, Ye, Leong, Henry
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Get full text
Conference Proceeding