On the Impact of Through-Silicon-Via-Induced Stress on 65-nm CMOS Devices
Weerasekera, R., Hong Yu Li, Lim Wei Yi, Hu Sanming, Jinglin Shi, Je Minkyu, Keng Hwa Teo
Published in IEEE electron device letters (01.01.2013)
Published in IEEE electron device letters (01.01.2013)
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Journal Article
A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs
Sanming Hu, Hoe, Yen Yi Germaine, Hongyu Li, Dan Zhao, Jinglin Shi, Yong Han, Keng Hwa Teo, Yong Zhong Xiong, Jin He, Xiaowu Zhang, Minkyu Je, Madihian, M.
Published in IEEE transactions on electron devices (01.03.2013)
Published in IEEE transactions on electron devices (01.03.2013)
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Journal Article
Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain
Sanming Hu, Cheng Jin, Hongyu Li, Rui Li, Ser Choong Chong, Ming Chinq Jong, Wai, Eva Leong Ching, Keng Hwa Teo, Minkyu Je, Lo, Patrick Guo Qiang
Published in IEEE transactions on electron devices (01.07.2014)
Published in IEEE transactions on electron devices (01.07.2014)
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Journal Article
A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction
Zhang, Li, Rafei, Siti Mohamed, Xie, Ling, Chew, Michelle Bi-Rong, Ji, Hong Miao, Chen, Yu, Rajoo, Ranjan, Ong, Kian-Leong, Tan, Rosemary, Lau, Suk-Hiang, Chow, Vincent T.K., Heng, Chew-Kiat, Teo, Keng-Hwa, Kang, Tae Goo
Published in Sensors and actuators. B, Chemical (15.12.2011)
Published in Sensors and actuators. B, Chemical (15.12.2011)
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Journal Article
Compatibility of Dielectric Passivation and Temporary Bonding Materials for Thin Wafer Handling in 3-D TSV Integration
Jaesik Lee, Seetoh, J., Hong Yu Li, Lee, V., Yen Chen Yeo, Guan Kian Lau, Keng Hwa Teo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
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Journal Article
Study of high speed interconnects of multiple dies stack structure with Through-Silicon-Via (TSV)
Zhang Wenle, Khoo Yee Mong, Lim Teck Guan, Damaruganath, P, Teo Keng Hwa, Zhang Xiaowu
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
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Conference Proceeding
Low standoff Chip to Wafer bonding
Ser Choong Chong, Wee, David Ho Soon, Keng Hwa Teo
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Investigation of 300 mm TSV wafer flatness with via middle scheme
Li Hongyu, Xie Jielin, Li Weihong, Teo Keng Hwa
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process
Ser Choong Chong, Jie Li Aw, Ching, Eva Wai Leong, Cereno, Daniel Ismael, Hong Yu Li, Vempati, Srinivasa Rao, Keng Hwa Teo
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
TSV via-last: Optimization of multilayer dielectric stack etching
Loh Woon Leng, Li Hongyu, Keng Hwa Teo, Murthy, R., Kiat, Eugene Tan Swee
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Novel thinning/backside passivation for substrate coupling depression of 3D IC
Woonseong Kwon, Jaesik Lee, Lee, V., Seetoh, J., Yenchen Yeo, YeeMong Khoo, Ranganathan, N., Keng Hwa Teo, Shan Gao
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Design for reliability in via middle and via last 3-D chipstacks incorporating TSVs
Trigg, A.D., Hong Yu, Li, Zhong Xiong, Yong, Jing Lin, Shi, Cheng Kuo, Cheng, Khan, Navas, Keng Hwa, Teo, Shan, Gao
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Advanced wafer thinning and handling for through silicon via technology
Jaesik Lee, Lee, V., Seetoh, J., Thew, S. M. L., Yen Chen Yeo, Hong Yu Li, Keng Hwa Teo, Shan Gao
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Power integrity modeling and measurement of TSV-based 3D IC system with application to the analysis of seven-chip stack
Lee, Hui Min, Liu, En-Xiao, Samudra, G.S., Li, Er-Ping, Li, Hong Yu, Teo, Keng Hwa
Published in IEEE electromagnetic compatibility magazine (01.01.2016)
Published in IEEE electromagnetic compatibility magazine (01.01.2016)
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Journal Article
Magazine Article
Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate
Jie Li Aw, Ser Choong Chong, Cereno, Daniel Ismael, KengHwa Teo, Rao, Vempati Srinivasa
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applications
Xie, Ling, Chew, Michelle, Premachandran, C.S., Zhang, Li, Rafei, Siti R.M., Ji, Hong Miao, Rajoo, Ranjan, Tang, Kum Cheong, Chen, Yu, Teo, Keng Hwa, Lau, Kelly Suk Hiang, Chow, Vincent T. K., Heng, Chew Kiat, Ong, Kian Leong, Tan, Rosemary
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding