TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
Wade, Mark, Anderson, Erik, Ardalan, Shahab, Bhargava, Pavan, Buchbinder, Sidney, L. Davenport, Michael, Fini, John, Lu, Haiwei, Li, Chen, Meade, Roy, Ramamurthy, Chandru, Rust, Michael, Sedgwick, Forrest, Stojanovic, Vladimir, Van Orden, Derek, Zhang, Chong, Sun, Chen, Shumarayev, Sergey Y., O'Keeffe, Conor, Hoang, Tim T., Kehlet, David, Mahajan, Ravi V., Guzy, Matthew T., Chan, Allen, Tran, Tina
Published in IEEE MICRO (01.03.2020)
Published in IEEE MICRO (01.03.2020)
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Journal Article
Silicon Process Technology Constraints for Standardized Vertical Die-to-Die Interconnects
Liew, Harrison, Sheikh, Farhana, Kehlet, David, Nikolic, Borivoje
Published in 2023 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2023)
Published in 2023 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2023)
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Conference Proceeding
Open-Source AXI4 Adapters for Chiplet Architectures
Dorairaj, Nij, Kehlet, David, Sheikh, Farhana, Zhang, Julie, Huang, YunHui, Wang, Shawn
Published in 2023 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2023)
Published in 2023 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2023)
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Conference Proceeding
An Exploration of ATPG Methods for Redacted IP and Reconfigurable Hardware
Fugate, Jackson, Stitt, Greg, Masna, Naren Vikram Raj, Dasgupta, Aritra, Bhunia, Swarup, Dorairaj, Nij, Kehlet, David
Published in 2023 IEEE 41st VLSI Test Symposium (VTS) (24.04.2023)
Published in 2023 IEEE 41st VLSI Test Symposium (VTS) (24.04.2023)
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Conference Proceeding
Hardware IP Protection against Confidentiality Attacks and Evolving Role of CAD Tool (Invited Paper)
Bhunia, Swarup, Das, Amitabh, Fazzari, Saverio, Kammler, Vivian, Kehlet, David, Rajendran, Jeyavijayan, Srivastava, Ankur
Published in 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) (29.10.2022)
Published in 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) (29.10.2022)
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Conference Proceeding
Timing Model for Chip-to-Chip Connection in a Package
Kuon, Ian, Wang, Xiangyong, Kehlet, David, Ojeda Aristizabal, Diana Cristina, Avci, Mehmet
Year of Publication 25.01.2024
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Year of Publication 25.01.2024
Patent
Electronics module keeps you swinging straight
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Magazine Article
Trade Publication Article
2.5D and 3D Heterogeneous Integration: Emerging applications
Sheikh, Farhana, Nagisetty, Ramune, Karnik, Tanay, Kehlet, David
Published in IEEE solid state circuits magazine (01.01.2021)
Published in IEEE solid state circuits magazine (01.01.2021)
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Journal Article