Electromigration Failure Mechanism and Lifetime Expectation for Bi-Modal Distribution in Cu/Low-k Interconnect
Young Jin Wee, Kim, A.T., Jung Eun Lee, Jae Yeol Maeng, Woon Hyuk Choi, Seowoo Nam, Seungjin Lee, Kyoung Woo Lee, Jaehak Kim, Keeyoung Jun, Seung Man Choi, Jaeouk Choo, Jungshik Heo, Hong Jae Shin, Nae In Lee
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding
Kinetics of TiN Chemical Vapor Deposition Process using TiCl 4 and NH 3 for ULSI Diffusion Barrier Applications: Relationship between Step Coverage and NH 3 Partial Pressure
Jun, Keeyoung, Egashira, Yasuyuki, Shimogaki, Yukihiro
Published in Japanese Journal of Applied Physics (01.10.2004)
Published in Japanese Journal of Applied Physics (01.10.2004)
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Journal Article
Substrate processing apparatus
Hong, Jongwon, Jun, Keeyoung, Cho, Choongrae, Yoon, Jung-soo, Park, Seonggil, Kim, Minjong, Park, Jaebeom
Year of Publication 05.11.2019
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Year of Publication 05.11.2019
Patent
SUBSTRATE PROCESSING APPARATUS
PARK Seonggil, CHO Choongrae, KIM Minjong, PARK Jaebeom, YOON Jung-soo, JUN Keeyoung, HONG Jongwon
Year of Publication 22.02.2018
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Year of Publication 22.02.2018
Patent
Method of treating a porous dielectric layer and a method of fabricating a semiconductor device using the same
Jun Keeyoung, Yim Taejin, Lee Naein, Ahn Sanghoon, Oszinda Thomas, Kim Byunghee
Year of Publication 21.02.2017
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Year of Publication 21.02.2017
Patent
METHOD OF TREATING A POROUS DIELECTRIC LAYER AND A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
JUN KEEYOUNG, AHN SANGHOON, OSZINDA THOMAS, YIM TAEJIN, KIM BYUNGHEE, LEE NAEIN
Year of Publication 26.05.2016
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Year of Publication 26.05.2016
Patent
THIN FILM MANUFACTURING APPARATUS AND THIN FILM MANUFACTURING METHOD
OOBA, YOSHIYUKI, OGURA, YUZURU, SEKINE, TAKAYUKI, SAKAMOTO, HITOSHI, JUN, KEEYOUNG
Year of Publication 11.08.2010
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Year of Publication 11.08.2010
Patent