Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application
Tatsumi, Kohei, Inagaki, Masakazu, Kamei, Kazuhito, Iizuka, Tomonori, Narimatsu, Hiroaki, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Imakiire, Akihiro, Hikita, Masayuki, Kamimura, Rikiya, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Design of protein-responsive micro-sized hydrogels for self-regulating microfluidic systems
Hirayama, Mayu, Tsuruta, Kazuhiro, Kawamura, Akifumi, Ohara, Masayuki, Shoji, Kan, Kawano, Ryuji, Miyata, Takashi
Published in Journal of micromechanics and microengineering (01.03.2018)
Published in Journal of micromechanics and microengineering (01.03.2018)
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Journal Article
6-in-1 Silicon carbide power module for high performance of power electronics systems
Ishino, Hiroshi, Watanabe, Tomokazu, Sugiura, Kazuhiko, Tsuruta, Kazuhiro
Published in 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) (01.06.2014)
Published in 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) (01.06.2014)
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Conference Proceeding
In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature
Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki
Published in Japanese Journal of Applied Physics (01.10.2019)
Published in Japanese Journal of Applied Physics (01.10.2019)
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Journal Article
Deep-P encapsulated 4H-SiC trench MOSFETs with ultra low RonQgd
Ebihara, Yasuhiro, Ichimura, Aiko, Mitani, Shuhei, Noborio, Masato, Takeuchi, Yuichi, Mizuno, Shoji, Yamamoto, Toshimasa, Tsuruta, Kazuhiro
Published in 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2018)
Published in 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2018)
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Conference Proceeding
Effect of annealing Co-W-P metallization substrate onto its resin adhesion
Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki
Published in Journal of materials science. Materials in electronics (01.07.2019)
Published in Journal of materials science. Materials in electronics (01.07.2019)
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Journal Article
Suppression of Bipolar Degradation in Deep-P Encapsulated 4H-SiC Trench MOSFETs up to Ultra-High Current Density
Ebihara, Yasuhiro, Uehara, Junichi, Ichimura, Aiko, Mitani, Shuhei, Noborio, Masato, Takeuchi, Yuichi, Tsuruta, Kazuhiro
Published in 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2019)
Published in 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2019)
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Conference Proceeding
Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique
Zhang, Zheng, Suetake, Aiji, Chen, Chuantong, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
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Conference Proceeding
Fast servo signal acquisition in tape drives using servo and data channels
Cherubini, Giovanni, Jelitto, Jens, Tsuruta, Kazuhiro
Published in Mechatronics (Oxford) (01.04.2012)
Published in Mechatronics (Oxford) (01.04.2012)
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Journal Article
Conference Proceeding
Macromol. Rapid Commun. 6/2015
Shiraki, Yusuke, Tsuruta, Kazuhiro, Morimoto, Junpei, Ohba, Chihiro, Kawamura, Akifumi, Yoshida, Ryo, Kawano, Ryuji, Uragami, Tadashi, Miyata, Takashi
Published in Macromolecular rapid communications. (01.03.2015)
Published in Macromolecular rapid communications. (01.03.2015)
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Journal Article
Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
Imakiire, Akihiro, Kozako, Masahiro, Hikita, Masayuki, Tatsumi, Kohei, Inagaki, Masakazu, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji, 明大, 今給黎, 雅裕, 小迫, 政幸, 匹田, 巽 宏平, 雅一, 稲垣, 智徳, 飯塚, 信明, 佐藤, 孝司, 清水, 和敏, 上田, 和彦, 杉浦, 和弘, 鶴田, 敬二, 戸田
Published in IEEJ JOURNAL OF INDUSTRY APPLICATIONS (2019)
Published in IEEJ JOURNAL OF INDUSTRY APPLICATIONS (2019)
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Journal Article
A robust adaptive control for parallel linear sliders using decoupling model
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Conference Proceeding