Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilane
Cheng, Y.L., Wang, Y.L., Hwang, G.J., O'Neill, M.L., Karwacki, E.J., Liu, P.T., Chen, C.F.
Published in Surface & coatings technology (24.02.2006)
Published in Surface & coatings technology (24.02.2006)
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Conference Proceeding
Organofluorosilicate glass: A dense low- k dielectric with superior materials properties
Cheng, Y.L., Wang, Y.L., Juang, Yungder, O’Neill, M.L., Lukas, A.S., Karwacki, E.J., McGuian, S.A., Tang, Allen, Wu, C.L.
Published in The Journal of physics and chemistry of solids (01.02.2008)
Published in The Journal of physics and chemistry of solids (01.02.2008)
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Conference Proceeding
Electron Attachment: A New Approach to 2 Fluxless Solder Reflow for Wafer Bumping
Dong, C.C, Patrick, R.E, Karwacki, E.J
Published in IEEE transactions on advanced packaging (01.08.2007)
Published in IEEE transactions on advanced packaging (01.08.2007)
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Journal Article
Electron Attachment: A New Approach to Fluxless Solder Reflow for Wafer Bumping
Dong, C.C., Patrick, R.E., Karwacki, E.J.
Published in IEEE transactions on advanced packaging (01.08.2007)
Published in IEEE transactions on advanced packaging (01.08.2007)
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Journal Article