Semiconductor interposer having a cavity for intra-interposer die
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Year of Publication 17.01.2017
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Stacked packaging using reconstituted wafers
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 22.03.2016
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Year of Publication 22.03.2016
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System-in-package with integrated socket
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 01.03.2016
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Year of Publication 01.03.2016
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Semiconductor package with improved testability
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 06.10.2015
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Year of Publication 06.10.2015
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Semiconductor package with a bridge interposer
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 16.06.2015
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Year of Publication 16.06.2015
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Programmable interposer with conductive particles
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 26.05.2015
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Year of Publication 26.05.2015
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Semiconductor package with integrated electromagnetic shielding
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 06.01.2015
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Year of Publication 06.01.2015
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Semiconductor packages with integrated heat spreaders
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 28.10.2014
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Year of Publication 28.10.2014
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Semiconductor package having an interposer configured for magnetic signaling
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, CHEN XIANGDONG, KHAN REZAUR RAHMAN, KARIKALAN SAMPATH K. V
Year of Publication 29.07.2014
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Year of Publication 29.07.2014
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Semiconductor package with integrated selectively conductive film interposer
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 10.06.2014
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Year of Publication 10.06.2014
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Semiconductor Package with Integrated Selectively Conductive Film Interposer
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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Semiconductor Packages with Integrated Heat Spreaders
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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System-In-Package with Integrated Socket
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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Semiconductor Package Having an Interposer Configured for Magnetic Signaling
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, CHEN XIANGDONG, KHAN REZAUR RAHMAN, KARIKALAN SAMPATH K. V
Year of Publication 01.08.2013
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Year of Publication 01.08.2013
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Stacked packaging using reconstituted wafers
KARIKALAN, SAMPATH K. V, KHAN, REZAUR RAHMAN, CHEN, XIANGDONG, ZHAO, SAM ZIQUN, VORENKAMP, PIETER, HU, KEVIN KUNZHONG
Year of Publication 21.10.2016
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Year of Publication 21.10.2016
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