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"Kappauf, Daniel"
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"Kappauf, Daniel"
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SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE WITH ENCAPSULATED PINS
by
KÜRTEN, Bernd
,
KAPPAUF
,
Daniel
Year of Publication
26.06.2024
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Support for electric components
by
Kappauf
,
Daniel
,
Namyslo, Lutz
Year of Publication
28.11.2023
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SUPPORT FOR ELECTRIC COMPONENTS
by
NAMYSLO, LUTZ
,
KAPPAUF
,
DANIEL
Year of Publication
10.11.2022
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SUPPORT FOR ELECTRICAL COMPONENTS
by
KAPPAUF
,
Daniel
,
NAMYSLO, Lutz
Year of Publication
20.04.2022
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Method for manufacturing a power module unit
by
Panicerski, Stanislav
,
Kappauf
,
Daniel
,
Schmenger, Jens
Year of Publication
27.02.2024
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METHOD FOR MANUFACTURING A POWER MODULE UNIT
by
PANICERSKI, Stanislav
,
SCHMENGER, Jens
,
KAPPAUF
,
Daniel
Year of Publication
01.11.2023
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METHOD FOR MANUFACTURING A POWER MODULE UNIT
by
SCHMENGER, JENS
,
PANICERSKI, STANISLAV
,
KAPPAUF
,
DANIEL
Year of Publication
27.04.2023
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SEMICONDUCTOR COMPONENT HAVING A DAMPING JOINING SURFACE IN A HOUSING HAVING
by
KURTEN BERND
,
KAPPAUF
,
DANIEL
Year of Publication
14.06.2024
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METHOD FOR PRODUCING A POWER MODULE UNIT
by
PANICERSKI, Stanislav
,
SCHMENGER, Jens
,
KAPPAUF
,
Daniel
Year of Publication
05.10.2022
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SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE WITH ENCAPSULATED PINS
by
KÜRTEN, Bernd
,
KAPPAUF
,
Daniel
Year of Publication
04.05.2023
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SEMICONDUCTOR ELEMENT WITH DAMPED BONDING SURFACE AREA IN A HOUSING WITH EMBEDDED PINS
by
Kappauf
,
Daniel
,
Kürten, Bernd
Year of Publication
03.05.2023
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Carrier for electrical component
by
NAMISILO, LUTZ
,
KAPPAUF
,
DANIEL
Year of Publication
17.05.2022
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SUPPORT FOR ELECTRICAL COMPONENTS
by
KAPPAUF
,
Daniel
,
NAMYSLO, Lutz
Year of Publication
01.04.2021
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SUPPORT FOR ELECTRICAL COMPONENTS
by
Kappauf
,
Daniel
,
Namyslo, Lutz
Year of Publication
31.03.2021
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METHOD FOR PRODUCING A POWER MODULE UNIT, POWER MODULE UNIT, NETWORK PART AND FREQUENCY CONVERTER
by
SCHMENGER, JENS
,
GOSPOS, ROBERT
,
PANICERSKI, STANISLAV
,
KAPPAUF
,
DANIEL
,
KNEUER, CHRISTIAN
,
NÄHRIG, MATTHIAS
Year of Publication
24.02.2022
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Method for producing power module unit
by
SCHMENGER JENS
,
KAPPAUF
,
DANIEL
,
PANICELSKI, STANISLAV
Year of Publication
14.10.2022
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METHOD FOR PRODUCING A POWER MODULE UNIT, POWER MODULE UNIT, NETWORK PART AND FREQUENCY CONVERTER
by
PANICERSKI, Stanislav
,
KNEUER, Christian
,
NÄHRIG, Matthias
,
SCHMENGER, Jens
,
GOSPOS, Robert
,
KAPPAUF
,
Daniel
Year of Publication
12.05.2021
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METHOD FOR PRODUCING A SEMICONDUCTOR MODULE WITH AT LEAST ONE SEMICONDUCTOR ARRANGEMENT AND A HEAT SINK
by
Kögler, Roman
,
Pfefferlein, Stefan
,
Kappauf
,
Daniel
,
Schmenger, Jens
Year of Publication
03.04.2024
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METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AT LEAST ONE SEMICONDUCTOR ARRANGEMENT AND A HEATSINK
by
KÖGLER, Roman
,
PFEFFERLEIN, Stefan
,
NÄHRIG, Matthias
,
SCHMENGER, Jens
,
KAPPAUF
,
Daniel
Year of Publication
08.02.2024
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METHOD FOR PRODUCING A POWER MODULE UNIT
by
PANICERSKI, Stanislav
,
SCHMENGER, Jens
,
KAPPAUF
,
Daniel
Year of Publication
02.09.2021
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