Warpage characterization of panel Fan-out (P-FO) package
Hung-Wen Liu, Yi-Wei Liu, Ji, Jason, Liao, Jash, Chen, Agassi, Yan-Heng Chen, Kao, Nicholas, Yi-Che Lai
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Alternative 3D Small form Factor Methodology of System in Package for IoT and Wearable Devices Application
Mike Tsai, Lan, Albert, Chi Liang Shih, Huang, Terence, Ryan Chiu, Chung, S. L., Chen, J. Y., Chu, Frank, Cheng Kai Chang, Sheng Ming Yang, Chen, Daniel, Kao, Nicholas
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
High Thermal Solution for 3D Integration Package
Chen, Ching Chia, Kao, Nicholas, Wang, Yu Po, Lin, Shane, Li, Yung Ta
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packaging
Li, Jay, Zhang, Zen-Wei, Lin, Vito, Lin, Sam, Shih, Teny, Kao, Nicholas, Wang, Yu-Po
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Enhance Larger FCBGA Package Evaluation and Characterization
Lin, Vito, Kao, Nicholas, Lai, David, Jiang, Don Son
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
Li, Jay, Hsu, Terry, Zhuan, Ming-Han, Lin, Sam, Shih, Teny, Kao, Nicholas, Wang, Yu-Po
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
High performance FCBGA Package Evaluation and Characterization for the Networking Application
Lin, Vito, Kao, Nicholas, Lai, David, Wang, Yu-Po
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Fan-Out Embedded Bridge Solution in HPC Application
Liu, Shuai-Lin Bradley, Kao, Nicholas, Shih, Teny, Wang, Yu-Po
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Warpage Assessment of Chip Module in Chip Last FO-MCM Platform for Non-wetting Risk Evaluation
Pan, George, Kao, Nicholas, Lai, David, Wang, Yu-Po
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
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Conference Proceeding
3DIC Stacking Process Investigation by Soldering Bonding Technology
Li, Jay, Jhen Chen, Wei, Lin, Joe, Hsuan Chan, Mu, Lo, Tank, Xu, Bruce, Yih Hung, Liang, Kao, Nicholas, Son Jiang, Don, Wang, Yu-Po
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration
Lia, Jay, Tsai, Fang-Lin, Li, Jackson, Pan, George, Chan, Mu-Hsuan, Zheng, Louise, Chen, Steven, Kao, Nicholas, Lai, David, Wan, Katch, Wang, Yu-Po
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer
Chang, Nistec, Chung, C. Key, Wang, Yu-Po, Lin, C. F., Su, PJ, Shih, Teny, Kao, Nicholas, Hung, Joe
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS
Chih-Sung Chen, Don Son Jiang, Kao, Nicholas
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Processing Models Based on Stress Conservation Law Utilized for Temperature-Dependent Warpage Prediction of MUF FCCSP with 3L ETS
Chen, Chih-Sung, Kao, Nicholas, Liao, Poyu, Lai, Ssu-Cheng, Jiang, Don Son
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Larger FCBGA package with thin and normal core evaluation and characterization
Vito Lin, Kao, Nicholas, Don Son Jiang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Different conservation laws utilized for warpage prediction of MUF FCCSP with 4L ETS
Chih-Sung Chen, Kao, Nicholas, Don Son Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Trend plots for compound selection utilized for warpage design of MUF FCCSP with 4L ETS
Chih-Sung Chen, Kao, Nicholas, Don Son Jiang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding