60-GHz SiGe BiCMOS dual-conversion down-converter: Schottky diode RF mixer and analog Gilbert IF mixer with microwave quadrature generator
Jen-Chieh Kao, Chinchun Meng, Hung-Ju Wei, Guo-Wei Huang
Published in 2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2016)
Published in 2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2016)
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Conference Proceeding
Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies
Chang-Lin Yeh, Yung-Yi Yeh, Jen-Chieh Kao, Tong Hong Wang, Chang-Chi Lee, Ho-Ming Tong
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Flexible Hybrid Electronics on Wearable Healthcare Application
Chen, Ming-Hung, Chang, Wei-Hao, Pi, Tun-Ching, Lee, Wei-Chun, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Patch-type Flex SiP Platform for Heathcare Application
Chen, Ming-Hung, Chang, Wei-Hao, Jian, Hui-Ping, Liu, Chao-Wei, Wu, Shang-Lin, Chou, Yi-Chun, Chiang, Sung-Hung, Chang, Jun-Kai, Pi, Tun-Ching, Lee, Wei-Chun, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
DSM Reballing Ball Height Prediction Model
Liu, Chao-Wei, Wu, Shang-Lin, Chen, Ming-Hung, Yeh, Chang-Lin, Pi, Tun-Ching, Kao, Jen-Chieh
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
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Conference Proceeding
V-band dual-conversion down-converter with Schottky-diode ring-mixer using 0.35μm SiGe BiCMOS process
Jen-Chieh Kao, Chinchun Meng, Tai-Lin Lo, Guo-Wei Huang
Published in 2015 Asia-Pacific Microwave Conference (APMC) (01.12.2015)
Published in 2015 Asia-Pacific Microwave Conference (APMC) (01.12.2015)
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Conference Proceeding
High Accuracy Selective Patterning for EMI Shielding of 5G AiP
Chen, Ming-Hung, Jian, Huei-Pin, Chou, Yi-Chun, Tsai, Yu-Shuan, Kuo, Kuan-Lin, Kao, Jen-Chieh
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Demonstration of flexible encapsulation in assembly industry
Liu, Chao-Wei, Chen, Ming-Hung, Pi, Tun-Ching, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface
Hsu, Chih-Jing, Fang, Hsu-Nan, Su, Tzu-Yu, Jiang, Zhao-Ze, Chen, Yi-Hua, Chen, Chien-Ching, Hsu, Che-Ming, Tsai, Yu-Pin, Chiang, Yuan-Feng, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding