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Year of Publication 25.01.2024
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Year of Publication 25.01.2024
Patent
Semiconductor package and method of manufacturing the same
SHIN IN SUP, KANG HYEONG MUN, KO JUNG MIN, BAEK SEUNG DUK, KIM TAE HYEONG
Year of Publication 14.07.2021
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Year of Publication 14.07.2021
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Novel method for NCF flow simulation in HBM thermal compression bonding process to optimize the NCF shape
Hong, Jong Pa, Lee, Su Chang, Han, Sun Woo, Oh, Sang Kun, Park, Sang Sik, Kang, Hyeong Mun, Kim, Won Keun, Kim, Kil Soo, Oh, Dan
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
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Year of Publication 18.01.2024
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Year of Publication 18.01.2024
Patent
Semiconductor package
KANG HYEONG-MUN, KO JUNG-MIN, SHIN IN-SUP, BAEK SEUNG-DUK, KIM TAE-HYOUNG
Year of Publication 06.07.2021
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Year of Publication 06.07.2021
Patent