Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI
Ji, Younggeun, Kim, Jeonghoon, Kim, Jungin, Lee, Miji, Noh, Jaeheon, Jeong, Taeyoung, Shin, Juhyeon, Kim, Junho, Heo, Young, Cho, Ung, Sagong, Hyunchul, Park, Junekyun, Choo, Yeonsik, Do, Gilhwan, Kang, Hoyoung, Choi, Eunkyeong, Sun, Dongyoon, Kang, Changki, Shin, Sangchul, Pae, Sangwoo
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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