Thermal fatigue behavior of J-lead solder joints
Schmidt, C.G., Simons, J.W., Kanazawa, C.H., Erlich, D.C.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1995)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1995)
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Low-cost matrix development for an Oxide-Oxide composite
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Published in Metals and materials (Seoul, Korea) (01.01.1998)
Published in Metals and materials (Seoul, Korea) (01.01.1998)
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