Tuning nickel silicide properties using a lamp based RTA, a heat conduction based RTA or a furnace anneal
Waidmann, S., Kahlert, V., Streck, C., Press, P., Kammler, T., Dittmar, K., Zienert, I., Rinderknecht, J.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Conference Proceeding
Human coronavirus NL63 replication is cyclophilin A-dependent and inhibited by non-immunosuppressive cyclosporine A-derivatives including Alisporivir
Carbajo-Lozoya, Javier, Ma-Lauer, Yue, Malešević, Miroslav, Theuerkorn, Martin, Kahlert, Viktoria, Prell, Erik, von Brunn, Brigitte, Muth, Doreen, Baumert, Thomas F., Drosten, Christian, Fischer, Gunter, von Brunn, Albrecht
Published in Virus research (12.05.2014)
Published in Virus research (12.05.2014)
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Journal Article
The effect of an additional ti layer in a sub-/spl mu/m double level Ti/TiN-AlSiCu-TiN metallization for a CMOS-logic-process
Stegemann, K.H., Beyer, C., Kahlert, V., Heinig, V., Pahner, J.
Published in European Workshop Materials for Advanced Metallization (1998)
Published in European Workshop Materials for Advanced Metallization (1998)
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Conference Proceeding
The effect of an additional Ti layer in a sub-/spl mu/m double level Ti/TiN-AlSiCu-TiN metallization for a CMOS-logic-process
Stegemann, K.H., Beyer, C., Kahlert, V., Heinig, V., Pahner, J.
Published in European Workshop Materials for Advanced Metallization (1997)
Published in European Workshop Materials for Advanced Metallization (1997)
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Conference Proceeding
Implementation of Robust Nickel Alloy Salicide Process for High-Performance 65nm SOI CMOS Manufacturing
Strane, J., Brown, D., Lavoie, C., Suenaga, J., Haran, B., Press, P., Besser, P., Flaitz, P., Gribelyuk, M., Kammler, T., Peidous, I., Huajie Chen, Waidmann, S., Frye, A., DeHaven, P., Domenicucci, A., Murray, C., Knarr, R., Engelmann, H.J., Streck, C., Kahlert, V., Deshpande, S., Leobandung, E., Pellerin, J., Jagannathan, J.
Published in 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.04.2007)
Published in 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.04.2007)
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