Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density
Kadoguchi, Takuya, Sakai, Tsubasa, Sei, Tsubasa, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki
Published in Journal of materials science. Materials in electronics (01.09.2017)
Published in Journal of materials science. Materials in electronics (01.09.2017)
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Journal Article
Evaluation of the number density of nuclei in Li2O·2SiO2 glass by DTA method
Wakasugi, Takashi, Kadoguchi, Takuya, Ota, Rikuo
Published in Journal of non-crystalline solids (01.09.2001)
Published in Journal of non-crystalline solids (01.09.2001)
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Journal Article
Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls
Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki
Published in Journal of materials science (01.03.2017)
Published in Journal of materials science (01.03.2017)
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Journal Article