Search Results - "KYUNG, YOU-JIN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Single-Finger Neural Basis Information-Based Neural Decoder for Multi-Finger Movements

Single-Finger Neural Basis Information-Based Neural Decoder for Multi-Finger Movements

by Choi, Hwayoung, You, Kyung-Jin, Thakor, Nitish V., Schieber, Marc H., Shin, Hyun-Chool
Published in IEEE transactions on neural systems and rehabilitation engineering (01.12.2018)

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Journal Article

Spectral Gini Index for Quantifying the Depth of Consciousness

Spectral Gini Index for Quantifying the Depth of Consciousness

by You, Kyung-Jin, Shin, Hyun-Chool, Noh, Gyu-Jeong
Published in Computational Intelligence and Neuroscience (01.01.2016)

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Journal Article

A new direction-of-arrival estimation method using automotive radar sensor arrays

A new direction-of-arrival estimation method using automotive radar sensor arrays

by Cho, Seunghoon, Song, Heemang, You, Kyung-Jin, Shin, Hyun-Chool
Published in International journal of distributed sensor networks (01.06.2017)

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Journal Article

Odor Discrimination Using Neural Decoding of the Main Olfactory Bulb in Rats

Odor Discrimination Using Neural Decoding of the Main Olfactory Bulb in Rats

by You, Kyung-Jin, Ham, Hyoung Geol, Lee, Hyun Joo, Lang, Yiran, Im, Changkyun, Koh, Chin Su, Kim, Mi-Yeon, Shin, Hyung-Cheul, Shin, Hyun-Chool
Published in IEEE transactions on biomedical engineering (01.05.2011)

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Journal Article

ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE AND ADHESIVE FILM CONTAINING THE SAME

ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE AND ADHESIVE FILM CONTAINING THE SAME

by KYUNG YOU JIN, JANG YOONSUN, JEONG MINSU, LEE KWANG JOO
Year of Publication 28.04.2021

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Patent

ADHESIVE COMPOSITION FOR SEMICONDUCTOR MOLDING PACKAGE AND FILM CONTAINING THE SAME

ADHESIVE COMPOSITION FOR SEMICONDUCTOR MOLDING PACKAGE AND FILM CONTAINING THE SAME

by KYUNG YOU JIN, JANG YOONSUN, JEONG MINSU, LEE KWANG JOO
Year of Publication 16.04.2021

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Patent

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

by LEE, Kwang Joo, KYUNG, You Jin, JEONG, Minsu
Year of Publication 06.08.2020

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Patent

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

by KYUNG YOU JIN, JEONG MINSU, LEE KWANG JOO
Year of Publication 06.08.2020

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Patent

adhesive composition for encapsulating semiconductor and adhesive using the same

adhesive composition for encapsulating semiconductor and adhesive using the same

by KYUNG YOU JIN, JANG YOON SUN, JEONG MIN SU, LEE KWANG JOO
Year of Publication 03.05.2021

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Patent

EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR FILM FOR MOLDING SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE USING THE SAME

EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR FILM FOR MOLDING SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE USING THE SAME

by KYUNG YOU JIN, JANG YOON SUN, JEONG MIN SU, LEE KWANG JOO
Year of Publication 30.04.2021

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Patent

ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUITS, AND ADHESIVE FILM INCLUDING SAME

ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUITS, AND ADHESIVE FILM INCLUDING SAME

by LEE, Kwang Joo, KYUNG, You Jin, KIM, Junghak, KIM, Youngsam, JEONG, Minsu, KIM, Ju Hyeon
Year of Publication 17.12.2020

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Patent

NON-CONDUCTIVE FILM AND PREPARATION METHOD FOR SEMICONDUCTOR LAMINATE

NON-CONDUCTIVE FILM AND PREPARATION METHOD FOR SEMICONDUCTOR LAMINATE

by LEE, Kwang Joo, HAN, Ji Ho, KYUNG, You Jin, JANG, Mi, KIM, Eun Yeong, YEON, Bora
Year of Publication 17.12.2020

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Patent

ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE USING THE SAME

ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE USING THE SAME

by NAM SEUNG HEE, KYUNG YOU JIN, KIM YOUNG SAM, KIM JUNG HAK, BYEON A YEONG, JEONG MIN SU
Year of Publication 22.07.2021

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Patent

RESIN COMPOSITION FOR SEMICONDUCTOR ADHESION ADHESIVE FILM METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME

RESIN COMPOSITION FOR SEMICONDUCTOR ADHESION ADHESIVE FILM METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME

by KYUNG YOU JIN, KIM JU HYEON, KIM JUNGHAK, JEONG MINSU, KIM YOUNGSAM, LEE KWANG JOO
Year of Publication 21.04.2021

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Patent

EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME

EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME

by KYUNG YOU JIN, JEONG MIN SU, LEE KWANG JOO
Year of Publication 11.05.2020

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Patent

ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM CONTAINING THE SAME

ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM CONTAINING THE SAME

by KYUNG YOU JIN, KIM JU HYEON, KIM JUNGHAK, JEONG MINSU, KIM YOUNGSAM, LEE KWANG JOO
Year of Publication 18.12.2020

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Patent

ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION ADHESIVE FILM METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME

ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION ADHESIVE FILM METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME

by KYUNG YOU JIN, KIM JU HYEON, KIM JUNGHAK, JEONG MINSU, KIM YOUNGSAM, LEE KWANG JOO
Year of Publication 18.11.2020

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Patent

EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME

EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME

by CHOI, BYUNG JU, JEONG, MIN SU, KYUNG, YOU JIN, LEE, KWANG JOO
Year of Publication 05.09.2019

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Patent

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR MOLDING, AND MOLDING FILM AND SEMICONDUCTOR PACKAGE USING SAME

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR MOLDING, AND MOLDING FILM AND SEMICONDUCTOR PACKAGE USING SAME

by LEE, Kwang Joo, JEONG, Woo Jae, KYUNG, You Jin, CHOI, Byung Ju, JEONG, Minsu, CHO, Eunbyurl
Year of Publication 18.07.2019

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Patent

METHOD FOR MANUFACTURING INSULATING LAYER FOR SEMICONDUCTOR PACKAGE, AND INSULATING LAYER FOR SEMICONDUCTOR PACKAGE, FORMED BY SAME METHOD

METHOD FOR MANUFACTURING INSULATING LAYER FOR SEMICONDUCTOR PACKAGE, AND INSULATING LAYER FOR SEMICONDUCTOR PACKAGE, FORMED BY SAME METHOD

by LEE, Kwang Joo, JEONG, Woo Jae, KYUNG, You Jin, CHOI, Byung Ju, JEONG, Minsu, CHO, Eunbyurl
Year of Publication 18.07.2019

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Patent

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