Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection
Kwon, W.-S., Paik, K.-W.
Published in IEEE transactions on components and packaging technologies (01.09.2006)
Published in IEEE transactions on components and packaging technologies (01.09.2006)
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Journal Article
Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards
Chung, Chang-Kyu, Kwon, Woon-Seong, Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.09.2007)
Published in IEEE transactions on components and packaging technologies (01.09.2007)
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Journal Article
Chip warpage model for reliability prediction of delamination failures
Yang, Se Young, Kwon, Woon-Seong, Lee, Soon-Bok
Published in Microelectronics and reliability (01.04.2012)
Published in Microelectronics and reliability (01.04.2012)
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Journal Article
Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications
Jang, K.-W., Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik
Published in IEEE transactions on components and packaging technologies (01.09.2004)
Published in IEEE transactions on components and packaging technologies (01.09.2004)
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Journal Article
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Kwon, Woon-Seong, Kim, Myongseob, Chang, Jonathan, Ramalingam, Suresh, Madden, Liam, Tsai, Genie, Tseng, Stephen, Lai, J.Y., Lu, Terren, Chiu, Steve
Published in Journal of microelectronics and electronic packaging (01.08.2015)
Published in Journal of microelectronics and electronic packaging (01.08.2015)
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Journal Article
New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGA
Kwon, Woon-Seong, Ramalingam, Suresh, Wu, Xin, Madden, Liam, Huang, C. Y., Chang, Hung-Hsien, Chiu, Chi-Hsin, Chiu, Steve, Chen, Stephen
Published in Journal of microelectronics and electronic packaging (01.07.2015)
Published in Journal of microelectronics and electronic packaging (01.07.2015)
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Journal Article
MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE
WU PAUL Y, KWON WOON SEONG, RAMALINGAM SURESH, KIM NAMHOON, KIM JOONG HO, LEUNG DENNIS C.P
Year of Publication 20.11.2015
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Year of Publication 20.11.2015
Patent
Effect of compressive stresses in anisotropic conductive films (ACFs) on contact resistance of flip chip joint
PAIK, Kyung-Wook, KWON, Woon-Seong
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
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Conference Proceeding
High current induced failure of ACAs flip chip joint
KWON, Woon-Seong, PAIK, Kyung-Wook
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING OF THE SAME
CHO, TAE JE, KANG, UN BYOUNG, KIM, JUNG HWAN, KWON, WOON SEONG, JANG, HYUNG SUN
Year of Publication 28.07.2011
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Year of Publication 28.07.2011
Patent
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING OF THE SAME
YI, DONG HUN, KIM, JUNG HWAN, KANG, UN BYOUNG, KWON, WOON SEONG, JANG, HYUNG SUN
Year of Publication 24.05.2010
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Year of Publication 24.05.2010
Patent