Selective Catalytic C—H Alkylation of Alkenes with Alcohols
Lee, Dong-Hwan, Kwon, Ki-Hyeok, Yi, Chae S.
Published in Science (American Association for the Advancement of Science) (16.09.2011)
Published in Science (American Association for the Advancement of Science) (16.09.2011)
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Journal Article
Synthesis of Naamidine A and Selective Access to N(2)-Acyl-2-aminoimidazole Analogues
Gibbons, Joseph B, Salvant, Justin M, Vaden, Rachel M, Kwon, Ki-Hyeok, Welm, Bryan E, Looper, Ryan E
Published in Journal of organic chemistry (16.10.2015)
Published in Journal of organic chemistry (16.10.2015)
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Journal Article
Innovative approach for semi‐continuous production of puerarin palmitate via transesterification with novel immobilized lipase
Lee, Hyeseon, Yang, Eunjeong, Kwon, Hyeok Ki, Kim, Bo Kyeong, Lee, Taek, Yoo, Hah Young, Park, Chulhwan
Published in Chemical and biological technologies in agriculture (14.03.2024)
Published in Chemical and biological technologies in agriculture (14.03.2024)
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Journal Article
Design and Testing of Augmented Reality-Based Fluorescence Imaging Goggle for Intraoperative Imaging-Guided Surgery
Lee, Seung Hyun, Quan, Yu Hua, Kim, Min Sub, Kwon, Ki Hyeok, Choi, Byeong Hyeon, Kim, Hyun Koo, Kim, Beop-Min
Published in Diagnostics (Basel) (21.05.2021)
Published in Diagnostics (Basel) (21.05.2021)
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Journal Article
Large Area Encapsulation: Solid Type Epoxy Molding Compound
Kim, Junghwa, Kim, JungSeob, Kwon, Ki-Hyeok, Yong, Yang-Seung, Kim, Jae-Hyun, Lee, Dong-Hwan, Kim, Sang-Kyun, Park, Deokhoon
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
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Conference Proceeding
Synthesis and characterization of hyperbranched thiol hardener and their curing behavior in thiol–epoxy
Song, Jin Han, Hong, Seung-Mo, Park, Seok Kyu, Kwon, Hyeok Ki, Hwang, Seok-Ho, Oh, Jong-Min, Koo, Sang-Mo, Lee, Giwon, Park, Chulhwan
Published in Macromolecular research (24.10.2024)
Published in Macromolecular research (24.10.2024)
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Journal Article
Effective Evaluation Method: A New Delamination Test Method for MUF (Molded Underfill) Package
Junghwa Kim, Seung Han, Woochul Na, Soyoon Kim, Ki Hyeok Kwon, Deokhoon Park, Donghwan Lee, Sang Kyun Kim
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding