Enhanced photocatalytic activity of Ti1-xVxO2 solid solution on the degradation of acetone
YU, J. C, LIN, J, KWOK, R. W. M
Published in Journal of photochemistry and photobiology. A, Chemistry. (01.12.1997)
Published in Journal of photochemistry and photobiology. A, Chemistry. (01.12.1997)
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Journal Article
Using a low-energy proton beam to cross-link polymer films for the protection of inorganic substrates: The case of Cu substrates
Zheng, Zhi, Zhao, Hongxiao, Fa, Wenjun, He, Weiwei, Wong, Ka-wai, Kwok, Raymund W.M.
Published in Surface and interface analysis (01.02.2017)
Published in Surface and interface analysis (01.02.2017)
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Journal Article
Ti1-xZrxO2 Solid Solutions for the Photocatalytic Degradation of Acetone in Air
YU, Jimmy C., LIN, Jun, KWOK, Raymund W. M.
Published in The journal of physical chemistry. B (25.06.1998)
Published in The journal of physical chemistry. B (25.06.1998)
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Journal Article
Enclosure with Metal Interior Surface Layer
Graham, Christopher S, Larsson, Karl Ruben F, Misra, Abhijeet, Kwok, Raymund W.M, Zhang, Guanglao, Wright, James A, Hill, Matthew D
Year of Publication 18.07.2019
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Year of Publication 18.07.2019
Patent
Enclosure with Metal Interior Surface Layer
Wright James A, Graham Christopher S, Zhang Guangtao, Misra Abhijeet, Kwok Raymund W.M, Larsson Karl Ruben F, Hill Matthew D
Year of Publication 12.04.2018
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Year of Publication 12.04.2018
Patent
SIMS analysis of lead isotope composition in ancient Chinese metallic artefacts
Yeung, Catherine S. L., Kwok, Raymund W. M., Lam, Peter Y. K., Wong, S. P., Hark, S. K., Jin, Zhengyao, Wong, Philip C. L., Yu, M. L., Mark, K. K.
Published in Surface and interface analysis (01.08.2000)
Published in Surface and interface analysis (01.08.2000)
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Journal Article
Reliability of interfaces for lead-free solder bumps
Shih, R.L.H., Lau, D.Y.K., Kwok, R.W.M., Li, M., Sun, M.K.W.
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
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Conference Proceeding