Electrical Performance of the Recessed Probe Launch Technique for Measurement of Embedded Multilayer Structures
Kotzev, M., Rimolo-Donadio, Renato, Kwark, Y. H., Baks, C. W., Gu, X., Schuster, C.
Published in IEEE transactions on instrumentation and measurement (01.12.2012)
Published in IEEE transactions on instrumentation and measurement (01.12.2012)
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Journal Article
Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control
Fan, Jun, Hardock, Andreas, Rimolo-Donadio, Renato, Müller, Sebastian, Kwark, Young H., Schuster, Christian
Published in IEEE electromagnetic compatibility magazine (01.01.2014)
Published in IEEE electromagnetic compatibility magazine (01.01.2014)
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Journal Article
Magazine Article
Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
Rimolo-Donadio, R., Xiaoxiong Gu, Kwark, Y.H., Ritter, M.B., Archambeault, B., de Paulis, F., Yaojiang Zhang, Jun Fan, Bruns, H.-D., Schuster, C.
Published in IEEE transactions on microwave theory and techniques (01.08.2009)
Published in IEEE transactions on microwave theory and techniques (01.08.2009)
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Journal Article
Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
Reuschel, Torsten, Preibisch, Jan B., Scharff, Katharina, Rimolo-Donadio, Renato, Xiaomin Duan, Kwark, Young H., Schuster, Christian
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
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Journal Article
A 10-Gb/s 5-Tap DFE/4-Tap FFE Transceiver in 90-nm CMOS Technology
Bulzacchelli, J.F., Meghelli, M., Rylov, S.V., Rhee, W., Rylyakov, A.V., Ainspan, H.A., Parker, B.D., Beakes, M.P., Aichin Chung, Beukema, T.J., Pepeljugoski, P.K., Shan, L., Kwark, Y.H., Gowda, S., Friedman, D.J.
Published in IEEE journal of solid-state circuits (01.12.2006)
Published in IEEE journal of solid-state circuits (01.12.2006)
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Journal Article
Conference Proceeding
A 24-Channel, 300 Gb/s, 8.2 pJ/bit, Full-Duplex Fiber-Coupled Optical Transceiver Module Based on a Single "Holey" CMOS IC
Schow, Clint L, Doany, Fuad E, Rylyakov, Alexander V, Lee, Benjamin G, Jahnes, Christopher V, Kwark, Young H, Baks, Christian W, Kuchta, Daniel M, Kash, Jeffrey A
Published in Journal of lightwave technology (15.02.2011)
Published in Journal of lightwave technology (15.02.2011)
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Journal Article
Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays
Müller, S., Xiaomin Duan, Kotzev, M., Yao-Jiang Zhang, Jun Fan, Xiaoxiong Gu, Kwark, Y. H., Rimolo-Donadio, R., Brüns, H-D, Schuster, C.
Published in IEEE transactions on electromagnetic compatibility (01.10.2012)
Published in IEEE transactions on electromagnetic compatibility (01.10.2012)
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Journal Article
Modeling On-Board Via Stubs and Traces in High-Speed Channels for Achieving Higher Data Bandwidth
Ki Jin Han, Xiaoxiong Gu, Kwark, Young H., Lei Shan, Ritter, Mark B.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2014)
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Journal Article
A Single-Chip CMOS-Based Parallel Optical Transceiver Capable of 240-Gb/s Bidirectional Data Rates
Schow, C.L., Doany, F.E., Baks, C.W., Kwark, Y.H., Kuchta, D.M., Kash, J.A.
Published in Journal of lightwave technology (01.04.2009)
Published in Journal of lightwave technology (01.04.2009)
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Journal Article
Using Via Stubs in Periodic Structures for Microwave Filter Design
Hardock, Andreas, Kwark, Young H., Rimolo-Donadio, Renato, Bruns, Heinz-Dietrich, Schuster, Christian
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
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Journal Article
A 24-Channel, 300 Gb/s, 8.2 pJ/bit, Full-Duplex Fiber-Coupled Optical Transceiver Module Based on a Single Holey CMOS IC
SCHOW, Clint L, DOANY, Fuad E, RYLYAKOV, Alexander V, LEE, Benjamin G, JAHNES, Christopher V, KWARK, Young H, BAKS, Christian W, KUCHTA, Daniel M, KASH, Jeffrey A
Published in Journal of lightwave technology (2011)
Published in Journal of lightwave technology (2011)
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Conference Proceeding
Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect Technologies
Deutsch, Alina, Krabbenhoft, Roger S, Melde, Kathleen L, Surovic, Christopher W, Katopis, George A, Kopcsay, Gerard V, Zhen Zhou, Zhaoqing Chen, Kwark, Young H, Winkel, Thomas-Michael, Xiaoxiong Gu, Standaert, Theodorus E
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
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Journal Article
High frequency measurement techniques for vias in printed circuit boards
Kotzev, Miroslav, Kwark, Young H., Muller, Sebastian, Hardock, Andreas, Rimolo-Donadio, Renato, Baks, Christian, Schuster, Christian
Published in IEEE electromagnetic compatibility magazine (01.01.2014)
Published in IEEE electromagnetic compatibility magazine (01.01.2014)
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Journal Article
Magazine Article
An Efficient Hybrid Finite-Element Analysis of Multiple Vias Sharing the Same Anti-Pad in an Arbitrarily Shaped Parallel-Plate Pair
Yao-Jiang Zhang, Liehui Ren, Dazhao Liu, De, Soumya, Xiaoxiong Gu, Kwark, Young H., Schuster, C., Jun Fan
Published in IEEE transactions on microwave theory and techniques (01.03.2015)
Published in IEEE transactions on microwave theory and techniques (01.03.2015)
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Journal Article
Proximity effects between striplines and vias
Kwark, Young H., Rimolo-Donadio, Renato, Baks, Christian W., Muller, Sebastian, Schuster, Christian
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station
Kuchta, D.M., Kwark, Y.H., Schuster, C., Baks, C., Haymes, C., Schaub, J., Pepeljugoski, P., Shan, L., John, R., Kucharski, D., Rogers, D., Ritter, M., Jewell, J., Graham, L.A., Schrodinger, K., Schild, A., Rein, H.-M.
Published in Journal of lightwave technology (01.09.2004)
Published in Journal of lightwave technology (01.09.2004)
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Journal Article
Novel multiport probing fixture for high frequency measurements in dense via arrays
Kwark, Y. H., Kotzev, M., Baks, C., Xiaoxiong Gu, Schuster, C.
Published in 2011 IEEE MTT-S International Microwave Symposium (01.06.2011)
Published in 2011 IEEE MTT-S International Microwave Symposium (01.06.2011)
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Conference Proceeding