PRINTED CIRCUIT BOARD FOR FLIP CHIP BONDING AND BALL GRID ARRAY PACKAGE MANUFACTURING METHOD USING THE SAME
HA, SEUNG WEON, KWAK, YONG IL, JUNG, YONG JIN, HAN, JUN SOO, KIM, GIL BEAG
Year of Publication 08.08.2007
Get full text
Year of Publication 08.08.2007
Patent
CHIP SCALE PACKAGE
HA, SEUNG WEON, KWAK, YONG IL, JUNG, YONG JIN, HAN, JUN SOO, KIM, GIL BEAG
Year of Publication 10.05.2007
Get full text
Year of Publication 10.05.2007
Patent