Fine grain 3D integration for microarchitecture design through cube packing exploration
Yongxiang Liu, Yuchun Ma, Kursun, E., Reinman, G., Cong, J.
Published in 2007 25th International Conference on Computer Design (01.10.2007)
Published in 2007 25th International Conference on Computer Design (01.10.2007)
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Conference Proceeding
Thermomechanical Stress-Aware Management for 3-D IC Designs
Qiaosha Zou, Kursun, Eren, Yuan Xie
Published in IEEE transactions on very large scale integration (VLSI) systems (01.09.2017)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.09.2017)
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Journal Article
Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors
Chundi, Pavan Kumar, Yini Zhou, Kim, Martha, Kursun, Eren, Mingoo Seok
Published in 2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) (01.07.2017)
Published in 2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) (01.07.2017)
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Conference Proceeding