COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN, CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN, COPPER METAL BUMP, HEAT CONDUCTION PATH, BONDING MATERIAL, AND LIQUID COMPOSITION
YAMAMOTO, KAZUNORI, KURODA, KYOUKO, YOKOZAWA, SHUNYA, MASUDA, KATSUYUKI, INADA, MAKI, KUMASHIRO, YASUSHI, NAKAKO, HIDEO, EJIRI, YOSHINORI
Year of Publication 24.03.2011
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Year of Publication 24.03.2011
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Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
INADA MAKI, KUMASHIRO YASUSHI, NAKAKO HIDEO, KURODA KYOUKO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI, YOKOZAWA SHUNYA
Year of Publication 22.04.2015
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Year of Publication 22.04.2015
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Metal copper film and fabricating method thereof, metal copper pattern and conductor wiring using the same, metal copper bump, heat conducting path, bonding material, and liquid composition
YAMAMOTO, KAZUNORI, KURODA, KYOUKO, YOKOZAWA, SHUNYA, MASUDA, KATSUYUKI, INADA, MAKI, KUMASHIRO, YASUSHI, NAKAKO, HIDEO, EJIRI, YOSHINORI
Year of Publication 01.08.2015
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Year of Publication 01.08.2015
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Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
INADA MAKI, KUMASHIRO YASUSHI, NAKAKO HIDEO, KURODA KYOUKO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI, YOKOZAWA SHUNYA
Year of Publication 13.06.2012
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Year of Publication 13.06.2012
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Metal copper film and fabricating method thereof, metal copper pattern and conductor wiring using the same, metal copper bump, heat conducting path, bonding material, and liquid composition
YAMAMOTO, KAZUNORI, KURODA, KYOUKO, YOKOZAWA, SHUNYA, MASUDA, KATSUYUKI, INADA, MAKI, KUMASHIRO, YASUSHI, NAKAKO, HIDEO, EJIRI, YOSHINORI
Year of Publication 16.05.2011
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Year of Publication 16.05.2011
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