A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration
Lee, Shih-Wei, Kuo, Shu-Chiao, Chen, Kuan-Neng
Published in Journal of nanoscience and nanotechnology (01.02.2018)
Published in Journal of nanoscience and nanotechnology (01.02.2018)
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Journal Article
Electrical testing structure for stacking error measurement in 3D integration
Shih-Wei Lee, Shu-Chiao Kuo, Kuan-Neng Chen
Published in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2016)
Published in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2016)
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Conference Proceeding
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
Yu-Tao Yang, Ting-Yang Yu, Shu-Chiao Kuo, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, Kuan-Neng Chen
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding