The Comparative Study of High and Low Temperature Cure Polyimide For Wafer Level Package With Ultra-Thick Re-distribution Copper Layer
Kuo Frank, Kuei Hsiao, Lin, Ting-en, Lin, Joey, Lin, Yu Sheng, Chen, Stan, Chien, Feng Lung
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package
Kuei Hsiao Kuo, Chen, Austin, Yen Neng Wang, Jiunn Jie Wang, Chang, Jovi, Feng Lung Chien, Lee, Rick
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Studying the Effect of Stackup Structure of Large Die Size Fan-In Wafer Level Package at 0.35 mm Pitch With Varying Ball Alloy to Enhance Board Level Reliability Performance
Kuei Hsiao Kuo, Chiang, Jerry, Kui Chang, Shu, Jack, Chien, F. L., Wang, Katch, Lee, Rick
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
The board level reliability performance and process challenges of ultra-thin WLP (package height < 250 μm)
Kuo, Kuei Hsiao, Yi Chiang, Chun, Chen, Kuang Hsin, Lin, Ting-en, Chen, Stan, Chien, Feng Lung
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
The Comparative Study to Enhance Board Level Reliability Performance of Wafer Level Package At 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology
Kuei Hsiao Kuo, Yi Sin Ting, Chui Feng Weng, Feng Lung Chien, Wan, Katch, Ho, C. S., Lee, Rick
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
The impact and performance of electromigration on fine pitch Cu pillar with different bump structure for flip chip packaging
Kuei Hsiao Kuo, Mao, Cindy, Wang, Katch, Lee, Jason, Chien, F. L., Lee, Rick
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Development of a no Reflow Cu Pillar Bump to Improve Chip/Package Interactions (CPI) Process and Reliability Performance
Kuo, Kuei Hsiao, Wang, Jiunn Jie, Wang, Yen Neng, Chien, Feng Lung, Lee, Rick
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Study of Small Polyimide Open Size in Contact Resistance and Reliability For Flip Chip Cu Pillar Package
Kuo Frank, Kuei Hsiao, Xiao, Shaun, Hwang, Abram, Chang, Kui, Chang, Jovi, Chien, Feng Lung
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Electromigration performance of Cu pillar bump for flip chip packaging with bump on trace by using thermal compression bonding
Frank, Kuei Hsiao Kuo, Lee, Jason, Chien, F. L., Lee, Rick, Mao, Cindy, Lau, John
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Electromigration performance of printed Sn0.7Cu bumps with immersion tin surface finishing for flip chip applications
Kuei Hsiao Kuo, Lee, J., Chen, S., Chien, F. L., Lee, R., Lau, J.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding