System-in-package with integrated socket
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 11.09.2013
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Year of Publication 11.09.2013
Patent
Semiconductor package with a bridge interposer
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDON, KARIKALAN SAMPATH K V
Year of Publication 03.07.2013
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Year of Publication 03.07.2013
Patent
Semiconductor package with ultra-thin interposer without through-semiconductor vias
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K V
Year of Publication 03.07.2013
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Year of Publication 03.07.2013
Patent