Semiconductor Package with Integrated Electromagnetic Shielding
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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Semiconductor Package with Integrated Selectively Conductive Film Interposer
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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Semiconductor Packages with Integrated Heat Spreaders
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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System-In-Package with Integrated Socket
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Year of Publication 29.08.2013
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Year of Publication 29.08.2013
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Semiconductor Package Having an Interposer Configured for Magnetic Signaling
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, CHEN XIANGDONG, KHAN REZAUR RAHMAN, KARIKALAN SAMPATH K. V
Year of Publication 01.08.2013
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Year of Publication 01.08.2013
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Semiconductor Package with Improved Testability
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 01.08.2013
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Year of Publication 01.08.2013
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Semiconductor Interposer Having a Cavity for Intra-Interposer Die
VORENKAMP PIETER, HU KEVIN KUNZHONG, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 18.07.2013
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Year of Publication 18.07.2013
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Semiconductor Package with a Bridge Interposer
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 04.07.2013
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Year of Publication 04.07.2013
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Programmable Interposer with Conductive Particles
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 04.07.2013
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Year of Publication 04.07.2013
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Semiconductor Package with Ultra-Thin Interposer Without Through-Semiconductor Vias
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 04.07.2013
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Year of Publication 04.07.2013
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Stacked Packaging Using Reconstituted Wafers
HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KARIKALAN SAMPATH K.V, KHAN REZAUR RAHMAN, CHEN XIANGDONG
Year of Publication 20.06.2013
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Year of Publication 20.06.2013
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Reconstituted interposer semiconductor package
LAW, EDWARD, KHAN, REZAUR RAHMAN, ZHAO, SAM ZIQUN, HU, KUNZHONG KEVIN
Year of Publication 11.04.2017
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Year of Publication 11.04.2017
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Stacked packaging using reconstituted wafers
KARIKALAN, SAMPATH K. V, KHAN, REZAUR RAHMAN, CHEN, XIANGDONG, ZHAO, SAM ZIQUN, VORENKAMP, PIETER, HU, KEVIN KUNZHONG
Year of Publication 21.10.2016
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Year of Publication 21.10.2016
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Semiconductor package with integrated electromagnetic shielding
KARIKALAN, SAMPATH K. V, KHAN, REZAUR RAHMAN, CHEN, XIANGDONG, ZHAO, SAM ZIQUN, VORENKAMP, PIETER, HU, KEVIN KUNZHONG
Year of Publication 21.07.2016
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Year of Publication 21.07.2016
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Semiconductor package with improved testability
KARIKALAN, SAMPATH K. V, KHAN, REZAUR RAHMAN, CHEN, XIANGDONG, ZHAO, SAM ZIQUN, VORENKAMP, PIETER, HU, KEVIN KUNZHONG
Year of Publication 21.08.2015
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Year of Publication 21.08.2015
Patent
System-in-package with integrated socket
KARIKALAN, SAMPATH K. V, KHAN, REZAUR RAHMAN, CHEN, XIANGDONG, ZHAO, SAM ZIQUN, VORENKAMP, PIETER, HU, KEVIN KUNZHONG
Year of Publication 21.07.2015
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Year of Publication 21.07.2015
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Semiconductor package with a bridge interposer
KARIKALAN, SAMPATH K. V, KHAN, REZAUR RAHMAN, CHEN, XIANGDONG, ZHAO, SAM ZIQUN, VORENKAMP, PIETER, HU, KEVIN KUNZHONG
Year of Publication 21.05.2015
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Year of Publication 21.05.2015
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