Search Results - "KUNG, Heng Yu" :: K.UTB vyhledávací portál

Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress

by Chen, Po-Ying, Kung, Heng-Yu, Lai, Yi-Shao, Tsai, Ming Hsiung, Yeh, Wen-Kuan
Published in Japanese Journal of Applied Physics (01.02.2008)

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The Effects of Minor Element on Performance of Ag Alloy Wires on Al Pad in the Package

by Ying-Ta Chiu, Yong-Sheng Zou, Ting-Chun Lin, Heng-Yu Kung
Published in 2016 3rd International Conference on Green Technology and Sustainable Development (GTSD) (01.11.2016)

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Conference Proceeding

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Elucidating the Effects of Current Stress History on Reliability Characteristics by Dynamic Analysis

by Chen, Po-Ying, Chen, Shen-Li, Tsai, Ming-Hsiung, Yeh, Wen-Kuan, Kung, Heng-Yu, Chang, YuKon
Published in Japanese Journal of Applied Physics (01.10.2008)

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Journal Article

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The effect of stressing history in reliability characteristics

by Po-Ying Chen, Heng-Yu Kung, Yi-Shao Lai, Wen-Kuan Yeh
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)

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Conference Proceeding

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An experimental investigation of current stressing on wafer-level chip-scale packages

by Yi-Shao Lai, Heng-Yu Kung, Po-Ying Chen, Wen-Kuan Yeh
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)

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Conference Proceeding

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Dynamic scanning method to clarify the mechanism of WLCSP package reliability issue

by Po-Ying Chen, Chwei-Shyong Tsai, Ming-Hsiung Tsai, Heng-Yu Kung, Shen-Li Chen, Jing, M.H., Wen-Kuan Yeh
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01.10.2008)

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Conference Proceeding