Brass bonding using copper nanoparticles and zinc powder for packaging of power electronic devices
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Published in Journal of alloys and compounds (05.06.2019)
Published in Journal of alloys and compounds (05.06.2019)
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Year of Publication 01.12.2022
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Year of Publication 01.12.2022
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Year of Publication 01.12.2023
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HOTTA YUTAKA, OSUGA SHINYA, SATO RYOTA, KUME YASUHIRO, KOBAYASHI YUSUKE
Year of Publication 02.09.2021
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Year of Publication 02.09.2021
Patent