Novel materials for electronic device fabrication using ink-jet printing technology
Kumashiro, Yasushi, Nakako, Hideo, Inada, Maki, Yamamoto, Kazunori, Izumi, Akira, Ishihara, Masamichi
Published in Applied surface science (30.11.2009)
Published in Applied surface science (30.11.2009)
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Journal Article
Conference Proceeding
ETCHING MATERIAL
INADA MAKI, KUMASHIRO YASUSHI, NOUDOU TAKAAKI, KURODA KYOKO, NAKAKO HIDEO
Year of Publication 30.06.2015
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Year of Publication 30.06.2015
Patent
ETCHING MATERIAL
INADA, MAKI, KURODA, KYOKO, KUMASHIRO, YASUSHI, NAKAKO, HIDEO, NOUDOU, TAKAAKI
Year of Publication 24.04.2014
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Year of Publication 24.04.2014
Patent
COPPER METAL FILM METHOD FOR PRODUCING SAME COPPER METAL PATTERN CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN COPPER METAL BUMP HEAT CONDUCTION PATH BONDIG MATERIAL AND LIQUID COMPOSITION
YOKOSAWA SHUNYA, INADA MAKI, KUMASHIRO YASUSHI, KURODA KYOKO, NAKAKO HIDEO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI
Year of Publication 22.04.2016
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Year of Publication 22.04.2016
Patent
COMPOSITION FOR FORMING SILICA-CONTAINING COATING FILM FOR INKJET APPLICATIONS, METHOD FOR FORMING SILICA-CONTAINING COATING FILM, SEMICONDUCTOR DEVICE, AND SOLAR CELL SYSTEM
KUMASHIRO YASUSHI, YOSHIKAWA TAKAHIRO, OKADA YUUHEI, SAKURAI HARUAKI, YAMAURA MASASHI
Year of Publication 16.08.2012
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Year of Publication 16.08.2012
Patent
COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN, CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN, COPPER METAL BUMP, HEAT CONDUCTION PATH, BONDIG MATERIAL, AND LIQUID COMPOSITION
YOKOSAWA SHUNYA, INADA MAKI, KUMASHIRO YASUSHI, KURODA KYOKO, NAKAKO HIDEO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI
Year of Publication 22.08.2012
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Year of Publication 22.08.2012
Patent