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Year of Publication 31.08.2023
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Year of Publication 31.08.2023
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Year of Publication 26.10.2021
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Year of Publication 07.07.2022
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ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
Tang, Yiqi, Wan, Liang, Murugan, Rajen Manicon, Kulkarni, Makarand Ramkrishna
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
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PLATED METAL LAYER IN POWER PACKAGES
WAN, Liang, MURUGAN, Rajen Manicon, TANG, Yiqi, KULKARNI, Makarand Ramkrishna, LOPEZ, Osvaldo Jorge, NOQUIL, Jonathan Almeria
Year of Publication 08.02.2024
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Year of Publication 08.02.2024
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Plated metal layer in power packages
Lopez, Osvaldo Jorge, Tang, Yiqi, Murugan, Rajen Manicon, Wan, Liang, Noquil, Jonathan Almeria, Kulkarni, Makarand Ramkrishna
Year of Publication 10.10.2023
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Year of Publication 10.10.2023
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SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
Tang, Yiqi, Murugan, Rajen Manicon, Wan, Liang, Kummerl, Steven Alfred, Chen, Jie, Kulkarni, Makarand Ramkrishna
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
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ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
SINHA, SNEHAMAY, BANDYOPADHYAY, TAPOBRATA, KULKARNI, MAKARAND RAMKRISHNA
Year of Publication 23.05.2019
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Year of Publication 23.05.2019
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PLATED METAL LAYER IN POWER PACKAGES
WAN, Liang, MURUGAN, Rajen Manicon, TANG, Yiqi, KULKARNI, Makarand Ramkrishna, LOPEZ, Osvaldo Jorge, NOQUIL, Jonathan Almeria
Year of Publication 09.06.2022
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Year of Publication 09.06.2022
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