Search Results - "KRUSIUS, J. Peter" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Novel compensation chemical metal polishing for low dishing and high global planarity for ultra-planar die applications in micro-optics and micro-electro-mechanical systems

Novel compensation chemical metal polishing for low dishing and high global planarity for ultra-planar die applications in micro-optics and micro-electro-mechanical systems

by Ganguly, Udayan, Peter Krusius, J.
Published in Thin solid films (22.07.2004)

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Journal Article

Fabrication of ultraplanar aluminum mirror array by novel encapsulation CMP for microoptics and MEMS applications

Fabrication of ultraplanar aluminum mirror array by novel encapsulation CMP for microoptics and MEMS applications

by GANGULY, Udayan, KRUSIUS, J. Peter
Published in Journal of the Electrochemical Society (2004)

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Journal Article

Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates

Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates

by George, A.G., Krusius, J.P., Granitz, R.F.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1996)

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Journal Article

Approaches toward ultralarge FPDs: Flat-panel display technology

Approaches toward ultralarge FPDs: Flat-panel display technology

by KRUSIUS, J. Peter, SERAPHIM, Donald P, GREENE, Raymond G, SKINNER, Dean S, YOST, Boris
Published in Proceedings of the IEEE (2002)

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Journal Article

Transient thermal response due to periodic heating on a convectively cooled substrate

Transient thermal response due to periodic heating on a convectively cooled substrate

by Fisher, T.S., Avedisian, C.T., Krusius, J.P.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1996)

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Journal Article

Physical design alternatives for RISC workstation packaging

Physical design alternatives for RISC workstation packaging

by O'Brien, D.E., Hahne, B.M., Krusius, J.P.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1993)

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Journal Article

CMOS shallow-trench-isolation to 50-nm channel widths

CMOS shallow-trench-isolation to 50-nm channel widths

by VanDerVoom, P., Gan, D., Krusius, J.P.
Published in IEEE transactions on electron devices (01.06.2000)

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Journal Article

Approaches toward ultralarge FPDs

Approaches toward ultralarge FPDs

by Krusius, J.P., Seraphim, D.P., Greene, R.G., Skinner, D.S., Yost, B.
Published in Proceedings of the IEEE (01.04.2002)

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Journal Article

Associate editors, guest editors, and reviewers

Associate editors, guest editors, and reviewers

Published in IEEE transactions on advanced packaging (01.05.2001)

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Journal Article

Electronic Components and Technology Conference (ECTC)

Electronic Components and Technology Conference (ECTC)

by KRUSIUS, J. Peter
Published in IEEE transactions on advanced packaging (1999)

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Conference Proceeding

Editor's statement

Editor's statement

by Krusius, J. Peter
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1998)

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Journal Article

Correction to "1997 list of reviewers"

Correction to "1997 list of reviewers"

by Krusius, J. Peter
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1998)

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Journal Article

Modeling and simulation of integrated capacitors for high frequency chip power decoupling

Modeling and simulation of integrated capacitors for high frequency chip power decoupling

by Diaz-Alvarez, E., Krusius, J.P., Kroeger, F.
Published in IEEE transactions on components and packaging technologies (01.12.2000)

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Journal Article

Spin-on-glass for 200 nm trench isolation structures

Spin-on-glass for 200 nm trench isolation structures

by Lutze, J W, Shacham-Diamand, Y Y, Krusius, J P
Published in Journal of micromechanics and microengineering (01.03.1991)

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Journal Article

Series resistance of silicided ohmic contacts for nanoelectronics

Series resistance of silicided ohmic contacts for nanoelectronics

by Chieh, Y.-S., Perera, A.K., Krusius, J.P.
Published in IEEE transactions on electron devices (01.08.1992)

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Journal Article

Heterojunction vertical FETs revisited: potential for 225-GHz large-current operation

Heterojunction vertical FETs revisited: potential for 225-GHz large-current operation

by Weinzierl, S.R., Krusius, J.P.
Published in IEEE transactions on electron devices (01.05.1992)

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Journal Article

METHOD FOR ASSEMBLING A TILED, FLAT-PANEL MICRODISPLAY ARRAY

METHOD FOR ASSEMBLING A TILED, FLAT-PANEL MICRODISPLAY ARRAY

by J., PETER KRUSIUS, DONALD, P. SERAPHIM
Year of Publication 08.04.2004

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Patent

Method for assembling a tiled, flat-panel microdisplay array

Method for assembling a tiled, flat-panel microdisplay array

by SERAPHIM, DONALD P, KRUSIUS, J. PETER
Year of Publication 01.04.2004

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Patent

METHOD FOR ASSEMBLING A TILED, FLAT-PANEL MICRODISPLAY ARRAY

METHOD FOR ASSEMBLING A TILED, FLAT-PANEL MICRODISPLAY ARRAY

by KRUSIUS, J., PETER, SERAPHIM, DONALD, P
Year of Publication 01.04.2004

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Patent

Characteristics of submicrometer gaps in buried-channel CCD structures

Characteristics of submicrometer gaps in buried-channel CCD structures

by Hoople, C.R., Krusius, J.P.
Published in IEEE transactions on electron devices (01.05.1991)

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Journal Article

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