Chemically Assisted Ion Beam Etching for Silicon‐Based Microfabrication
Chieh, Y. S., Krusius, J. P., Chapman, P.
Published in Journal of the Electrochemical Society (01.06.1994)
Published in Journal of the Electrochemical Society (01.06.1994)
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Journal Article
Field oxide thinning in poly buffer LOCOS isolation with active area spacings to 0.1 μm
LUTZE, J. W, PERERA, A. H, KRUSIUS, J. P
Published in Journal of the Electrochemical Society (01.06.1990)
Published in Journal of the Electrochemical Society (01.06.1990)
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Journal Article
Series resistance of silicided ohmic contacts for nanoelectronics
Chieh, Y.-S., Perera, A.K., Krusius, J.P.
Published in IEEE transactions on electron devices (01.08.1992)
Published in IEEE transactions on electron devices (01.08.1992)
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Journal Article
Band renormalization and dynamic screening in near band gap femtosecond optical probing of InGaAs
Bair, J.E., Cohen, D., Krusius, J.P., Pollock, C.R.
Published in Solid state communications (01.10.1994)
Published in Solid state communications (01.10.1994)
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Journal Article
Lateral space-charge effects on ballistic electron transport across graded heterojunctions
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Journal Article
Conference Proceeding
Probabilistic prediction of wireability and routing requirements for high density interconnect substrates
Diaz-Alvarez, E., Krusius, J.P.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article
CMOS shallow-trench-isolation to 50-nm channel widths
VanDerVoom, P., Gan, D., Krusius, J.P.
Published in IEEE transactions on electron devices (01.06.2000)
Published in IEEE transactions on electron devices (01.06.2000)
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Journal Article
Approaches toward ultralarge FPDs
Krusius, J.P., Seraphim, D.P., Greene, R.G., Skinner, D.S., Yost, B.
Published in Proceedings of the IEEE (01.04.2002)
Published in Proceedings of the IEEE (01.04.2002)
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Journal Article
Transient thermal management in electronic packaging using dynamic control of power dissipation and heat transfer
Cao, L., Krusius, J.P., Korhonen, M., Fisher, T.
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Tiled silicon: a packaging alternative to large silicon chips
George, G., Krusius, J.P., Granitz, R.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding
Journal Article