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"KOTAKE TOMOHIKO"
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"KOTAKE TOMOHIKO"
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POLYFUNCTIONAL VINYLBENZYL COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATED SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
YAMASHITA Takeshi
,
KOTAKE Tomohiko
Year of Publication
31.10.2024
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HYDROPHILIC COMPOSITION, HYDROPHILIC FILM, METHOD FOR PRODUCING HYDROPHILIC FILM, AND ARTICLE WITH HYDROPHILIC FILM
by
YOSHIKAWA TOMOSATO
,
KOTAKE TOMOHIKO
Year of Publication
25.06.2024
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PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
KOBAYASHI, Yuzuru
,
KOTAKE Tomohiko
Year of Publication
11.04.2024
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수지 조성물, 수지 필름, 프린트 배선판 및 반도체 패키지
by
KUZUOKA HIROKI
,
KOTAKE TOMOHIKO
Year of Publication
08.03.2024
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PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
KOTAKE Tomohiko
,
KOBAYASHI Yuzuru
Year of Publication
01.02.2024
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RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
by
YAMASHITA Takeshi
,
KOTAKE Tomohiko
Year of Publication
23.11.2023
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RESIN COMPOSITION, RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
KUZUOKA, Hiroki
,
KOTAKE
,
Tomohiko
Year of Publication
12.01.2023
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RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
KUZUOKA, Hiroki
,
KOTAKE
,
Tomohiko
Year of Publication
12.01.2023
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MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
SUZUKI TAKAYUKI
,
KOTAKE TOMOHIKO
Year of Publication
23.08.2022
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SILOXANE-MODIFIED LIQUID CRYSTAL POLYMER, THERMOSETTING RESIN COMPOSITION, METAL FOIL WITH RESIN, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SILOXANE-MODIFIED LIQUID CRYSTAL POLYMER
by
YAMASHITA TAKESHI
,
KOTAKE TOMOHIKO
Year of Publication
18.08.2022
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RESIN COMPOSITION, RESIN FILM, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE
by
KUZUOKA Hiroki
,
KOTAKE Tomohiko
,
IKEYA Takuji
Year of Publication
04.07.2024
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SUPPORT BODY-EQUIPPED RESIN FILM, MANUFACTURING METHOD FOR PRINTED WIRING BOARD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE
by
KUZUOKA Hiroki
,
KOTAKE Tomohiko
,
IKEYA Takuji
Year of Publication
04.07.2024
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RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
by
KUZUOKA Hiroki
,
KOTAKE Tomohiko
,
IKEYA Takuji
Year of Publication
04.07.2024
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RESIN-CLAD METAL FOIL, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
by
KUZUOKA Hiroki
,
KOTAKE Tomohiko
,
IKEYA Takuji
Year of Publication
04.07.2024
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SOUND-ABSORBING MATERIAL, SOUND-ABSORPTION-IMPROVING COATING, AND SOUND-ABSORPTION-IMPROVING SHEET
by
TAKAYASU Satoshi
,
KOTAKE Tomohiko
Year of Publication
28.01.2021
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SOUND-ABSORBING MATERIAL, COATING SOLUTION FOR IMPROVING SOUND ABSORPTION, AND SHEET FOR IMPROVING SOUND ABSORPTION
by
TAKAYASU Satoshi
,
KOTAKE Tomohiko
Year of Publication
28.01.2021
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SOUND-ABSORBING MATERIAL
by
TAKAYASU Satoshi
,
KOTAKE Tomohiko
Year of Publication
22.10.2020
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SOUND-ABSORBING MATERIAL
by
TAKAYASU Satoshi
,
KOTAKE Tomohiko
Year of Publication
22.10.2020
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SOUND-ABSORBING MATERIAL
by
TAKAYASU Satoshi
,
KOTAKE Tomohiko
Year of Publication
22.10.2020
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METHOD FOR MANUFACTURING SOUND-ABSORBING MEMBER
by
TAKAYASU Satoshi
,
KOTAKE Tomohiko
,
SHIMIZU Mari
Year of Publication
28.12.2023
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