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"KOOPMANS, MICHEL"
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"KOOPMANS, MICHEL"
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Understanding the association between pain and delirium in older hospital inpatients: systematic review and meta-analysis
by
White, Nicola
,
Bazo-Alvarez, Juan Carlos
,
Koopmans
,
Michel
,
West, Emily
,
Sampson, Elizabeth L
Published in
Age and ageing
(01.04.2024)
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Thermal pads between stacked semiconductor dies and associated systems and methods
by
Koopmans
,
Michel
,
Gandhi, Jaspreet S
Year of Publication
09.07.2024
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Patent
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SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME, AND METHODS OF FABRICATION
by
ENGLAND LUKE G
,
KOOPMANS MICHEL
,
SILVESTRI PAUL A
Year of Publication
20.03.2014
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APPARATUSES AND METHODS FOR FORMING DIE STACKS
by
Koopmans
,
Michel
Year of Publication
22.11.2018
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Patent
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Apparatuses and methods for forming die stacks
by
Koopmans
,
Michel
Year of Publication
28.08.2018
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APPARATUSES AND METHODS FOR FORMING DIE STACKS
by
Koopmans
,
Michel
Year of Publication
19.04.2018
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Patent
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Apparatuses and methods for forming die stacks
by
Koopmans Michel
Year of Publication
30.01.2018
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APPARATUSES AND METHODS FOR FORMING DIE STACKS
by
KOOPMANS MICHEL
Year of Publication
03.08.2017
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APPARATUSES AND METHODS FOR FORMING DIE STACKS
by
KOOPMANS MICHEL
Year of Publication
15.06.2017
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Apparatuses and methods for forming die stacks
by
Koopmans Michel
Year of Publication
23.05.2017
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THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS
by
Koopmans
,
Michel
,
Gandhi, Jaspreet S
Year of Publication
31.12.2020
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Thermal pads between stacked semiconductor dies and associated systems and methods
by
Koopmans
,
Michel
,
Gandhi, Jaspreet S
Year of Publication
12.05.2020
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THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS
by
Koopmans
,
Michel
,
Gandhi, Jaspreet S
Year of Publication
03.01.2019
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Thermal pads between stacked semiconductor dies and associated systems and methods
by
Koopmans
,
Michel
,
Gandhi, Jaspreet S
Year of Publication
09.10.2018
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Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
by
Hembree, David R
,
Luo, Shijian
,
Koopmans
,
Michel
Year of Publication
29.10.2019
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SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME, AND METHODS OF FABRICATION
by
ENGLAND, Luke G
,
KOOPMANS
,
Michel
,
SILVESTRI, Paul A
Year of Publication
07.07.2021
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THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS
by
Gandhi Jaspreet S
,
Koopmans Michel
Year of Publication
07.12.2017
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Thermal pads between stacked semiconductor dies and associated systems and methods
by
Gandhi Jaspreet S
,
Koopmans Michel
Year of Publication
19.09.2017
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Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
by
Koopmans
,
Michel
Year of Publication
29.12.2009
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Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
by
KOOPMANS MICHEL
Year of Publication
29.12.2009
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