Sparse Emission Source Microscopy for Rapid Emission Source Imaging
Ling Zhang, Khilkevich, Victor V., Xiangyang Jiao, Xiao Li, Toor, Sukhjinder, Bhobe, Alpesh U., Kyoungchoul Koo, Pommerenke, David, Drewniak, James L.
Published in IEEE transactions on electromagnetic compatibility (01.04.2017)
Published in IEEE transactions on electromagnetic compatibility (01.04.2017)
Get full text
Journal Article
A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs
KIM, Myunghoi, KOO, Kyoungchoul, HWANG, Chulsoon, SHIM, Yujeong, KIM, Joungho, KIM, Jonghoon
Published in IEEE transactions on electromagnetic compatibility (01.06.2012)
Published in IEEE transactions on electromagnetic compatibility (01.06.2012)
Get full text
Journal Article
Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis
Bae, Bumhee, Shim, Yujeong, Koo, Kyoungchoul, Cho, Jonghyun, Pak, Jun So, Kim, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.12.2013)
Published in IEEE transactions on electromagnetic compatibility (01.12.2013)
Get full text
Journal Article
Modeling of Eye-Diagram Distortion and Data-Dependent Jitter in Meander Delay Lines on High-Speed Printed Circuit Boards (PCBs) Based on a Time-Domain Even-Mode and Odd-Mode Analysis
Gawon Kim, Gawon Kim, Dong Gun Kam, Dong Gun Kam, Seung Jae Lee, Seung Jae Lee, Jaemin Kim, Jaemin Kim, Myunghyun Ha, Myunghyun Ha, Kyoungchoul Koo, Kyoungchoul Koo, Jun So Pak, Jun So Pak, Joungho Kim, Joungho Kim
Published in IEEE transactions on microwave theory and techniques (01.08.2008)
Published in IEEE transactions on microwave theory and techniques (01.08.2008)
Get full text
Journal Article
Fast decap assignment algorithm for optimization of power distribution networks
Kyoungchoul Koo, Romo, L. Gerardo, Tao Wang, Michalka, Tim, Drewniak, James
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Get full text
Conference Proceeding
Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs
KIM, Myunghoi, KOO, Kyoungchoul, SHIM, Yujeong, HWANG, Chulsoon, JUN SO PAK, AHN, Seungyoung, KIM, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.04.2013)
Published in IEEE transactions on electromagnetic compatibility (01.04.2013)
Get full text
Journal Article
Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects
KIM, Kiyeong, HWANG, Chulsoon, KOO, Kyoungchoul, CHO, Jonghyun, KIM, Heegon, KIM, Joungho, LEE, Junho, LEE, Hyung-Dong, PARK, Kun-Woo, JUN SO PAK
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2012)
Get full text
Journal Article
SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ Gbps applications
Talebzadeh, Atieh, Kyoungchoul Koo, Vuppunutala, Pranay Kumar, Nadolny, Jim, Li, Angela, Qian Liu, Sochoux, Philippe, Pommerenke, David, Drewniak, James L.
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Get full text
Conference Proceeding
Analytical expressions for maximum transferred power in wireless power transfer systems
Sunkyu Kong, Myunghoi Kim, Kyoungchoul Koo, Seungyoung Ahn, Bumhee Bae, Joungho Kim
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Get full text
Conference Proceeding
Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC
Kyoungchoul Koo, Myunghoi Kim, Kim, Jonghoon J., Joungho Kim, Jiseong Kim
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2013)
Get full text
Journal Article
Extended CPM for system power integrity analysis
Kyoungchoul Koo
Published in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2015)
Published in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2015)
Get full text
Conference Proceeding
Measurement and analysis of vertical noise coupling on low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC
Kyoungchoul Koo, Myunghoi Kim, Sangrok Lee, Joungho Kim
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Get full text
Conference Proceeding
Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter
Kyoungchoul Koo, Jiseong Kim, Myunghoi Kim, Joungho Kim
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Get full text
Conference Proceeding
Design of coupled resonators for wireless power transfer to mobile devices using magnetic field shaping
Woojin Ahn, Sungkwan Jung, Wonkyum Lee, Sangsik Kim, Junseok Park, Jaegue Shin, Hongseok Kim, Kyoungchoul Koo
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
Get full text
Conference Proceeding
Design and experimental verification of on-chip signal integrity analyzer (OSIA) scheme for eye diagram monitoring of a high-speed serial link
Minchul Shin, Myunghoi Kim, Kyoungchoul Koo, Sunkyu Kong, Joungho Kim
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Get full text
Conference Proceeding