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INDUCTOR WITH METAL SHIELD

INDUCTOR WITH METAL SHIELD

by BABY ANIL, DUBEY SAGAR, BALAKRISHNAN RANJUL, KONG JACKSON CHUNG PENG
Year of Publication 18.02.2022

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Patent

COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES

COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES

by OOI PING PING, ONG JENNY SHIO YIN, LIM SEOK LING, CHEAH BOK ENG, KONG JACKSON CHUNG PENG
Year of Publication 22.06.2021

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Patent

MICRO-HINGE FOR AN ELECTRONIC DEVICE

MICRO-HINGE FOR AN ELECTRONIC DEVICE

by CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, KONG JACKSON CHUNG PENG
Year of Publication 03.09.2019

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Patent

INTEGRATED CIRCUIT PACKAGING TECHNIQUES AND CONFIGURATIONS FOR SMALL FORM-FACTOR OR WEARABLE DEVICES

INTEGRATED CIRCUIT PACKAGING TECHNIQUES AND CONFIGURATIONS FOR SMALL FORM-FACTOR OR WEARABLE DEVICES

by SKINNER MICHAEL P, CHEAH BOK ENG, PERIAMAN SHANGGAR, KONG JACKSON CHUNG PENG, OOI KOOI CHI
Year of Publication 28.06.2016

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Patent

FLEXIBLE PACKAGING ARCHITECTURE

FLEXIBLE PACKAGING ARCHITECTURE

by CHEAH BOK ENG, PERIAMAN SHANGGAR, SKINNER MICHAEL, MAR KHENG TAT, ABD RAZAK RIDZA EFFENDI, KONG JACKSON CHUNG PENG, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 24.01.2018

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Patent

MICRO-HINGE FOR AN ELECTRONIC DEVICE

MICRO-HINGE FOR AN ELECTRONIC DEVICE

by CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, KONG JACKSON CHUNG PENG
Year of Publication 05.10.2016

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Patent

FLEXIBLE PACKAGING ARCHITECTURE

FLEXIBLE PACKAGING ARCHITECTURE

by CHEAH BOK ENG, PERIAMAN SHANGGAR, SKINNER MICHAEL, MAR KHENG TAT, ABD RAZAK RIDZA EFFENDI, KONG JACKSON CHUNG PENG, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 02.05.2016

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Patent

INTERCONNECT CORE

INTERCONNECT CORE

by Kong, Jackson Chung Peng
Year of Publication 26.09.2019

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Patent

Semiconductor package, semiconductor system, and method of forming semiconductor package

Semiconductor package, semiconductor system, and method of forming semiconductor package

by Cheah, Bok Eng, Kong, Jackson Chung Peng
Year of Publication 04.10.2022

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Patent

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

by CHEAH, Bok Eng, TEH, Kok Hou, KONG, Jackson Chung Peng
Year of Publication 04.01.2024

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Patent

Three dimensional foldable substrate with vertical side interface

Three dimensional foldable substrate with vertical side interface

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng
Year of Publication 12.09.2023

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Patent

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SYSTEM, AND METHOD OF FORMING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SYSTEM, AND METHOD OF FORMING SEMICONDUCTOR PACKAGE

by CHEAH, Bok Eng, KONG, Jackson Chung Peng
Year of Publication 09.12.2021

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Patent

SEMICONDUCTOR PACKAGE WITH WARPAGE CONTROL

SEMICONDUCTOR PACKAGE WITH WARPAGE CONTROL

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Kuan, Chin Lee
Year of Publication 20.04.2023

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Patent

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Chee, Choong Kooi, Lee, Wai Ling, Tan, Tat Hin
Year of Publication 08.10.2024

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Patent

3D trench reference planes for integrated-circuit die packages

3D trench reference planes for integrated-circuit die packages

by Kong, Jackson Chung Peng, Cheah, Bok Eng, Kuan, Chin Lee
Year of Publication 17.01.2023

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Patent

Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates

Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Kuan, Chin Lee
Year of Publication 27.12.2022

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Patent

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Chee, Choong Kooi, Lee, Wai Ling, Tan, Tat Hin
Year of Publication 03.09.2024

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Patent

Stepped interposer for stacked chip package

Stepped interposer for stacked chip package

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Kuan, Chin Lee
Year of Publication 13.12.2022

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Patent

THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE

THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng
Year of Publication 17.11.2022

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Patent

Electronic device and crosstalk mitigating substrate

Electronic device and crosstalk mitigating substrate

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Min Suet
Year of Publication 09.07.2024

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Patent

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