Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study
Yeap, Kong Boon, Zschech, Ehrenfried, Hangen, Ude D., Wyrobek, Thomas, Kong, Lay Wai, Karmakar, Aditya, Xu, Xiaopeng, Panchenko, Iuliana
Published in Journal of materials research (14.01.2012)
Published in Journal of materials research (14.01.2012)
Get full text
Journal Article
Infrared microscopy for overlay and defect metrology on 3D-interconnect bonded wafers
Rudack, Andrew C, Lay Wai Kong, Baker, Greg G
Published in 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.07.2010)
Published in 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.07.2010)
Get full text
Conference Proceeding
센서 통합 패키지 제조 방법 및 이로부터 형성된 구조물
SOTO GONZALEZ JAVIER, KONG LAY WAI, SALAMA ISLAM A, LEE KYU OH, ZHOU ZHENG, OSTER SASHA N, EID FERAS
Year of Publication 29.11.2017
Get full text
Year of Publication 29.11.2017
Patent
Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring
Kong, Lay Wai, Martin, Osborne A.
Published in 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (01.05.2018)
Published in 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (01.05.2018)
Get full text
Conference Proceeding
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY
SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Year of Publication 04.10.2023
Get full text
Year of Publication 04.10.2023
Patent
COMPUTATIONAL DATA STORAGE SYSTEMS
KONG, Lay Wai, ADAMS, Ian F, MCLERAN, Daniel Robert, BARCZAK, Mariusz, RAGHUNATH, Arun, KEYS, John S, MESNIER, Michael P, ZOU, Yi, MARIA REMIS, Luis Carlos
Year of Publication 07.12.2022
Get full text
Year of Publication 07.12.2022
Patent
COMPUTATIONAL DATA STORAGE SYSTEMS
Mesnier, Michael P, Remis, Luis Carlos Maria, Zou, Yi, Keys, John S, Kong, Lay Wai, Raghunath, Arun, Adams, Ian F, McLeran, Daniel Robert, Barczak, Mariusz
Year of Publication 16.06.2022
Get full text
Year of Publication 16.06.2022
Patent
COMPUTATIONAL DATA STORAGE SYSTEMS
KONG, Lay Wai, ADAMS, Ian F, MCLERAN, Daniel Robert, BARCZAK, Mariusz, RAGHUNATH, Arun, KEYS, John S, MESNIER, Michael P, ZOU, Yi, MARIA REMIS, Luis Carlos
Year of Publication 19.01.2022
Get full text
Year of Publication 19.01.2022
Patent
COMPUTATIONAL DATA STORAGE SYSTEMS
KONG, Lay Wai, ADAMS, Ian F, MCLERAN, Daniel Robert, BARCZAK, Mariusz, RAGHUNATH, Arun, KEYS, John S, MESNIER, Michael P, ZOU, Yi, MARIA REMIS, Luis Carlos
Year of Publication 17.09.2020
Get full text
Year of Publication 17.09.2020
Patent
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY
SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Year of Publication 05.12.2018
Get full text
Year of Publication 05.12.2018
Patent
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY
SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Year of Publication 31.01.2018
Get full text
Year of Publication 31.01.2018
Patent
Methods of forming sensor integrated packages and structures formed thereby
Salama Islam A, Eid Feras, Lee Kyu Oh, Kong Lay Wai, Zhou Zheng, Oster Sasha N, Soto Gonzalez Javier
Year of Publication 29.11.2016
Get full text
Year of Publication 29.11.2016
Patent
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY
SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Year of Publication 06.10.2016
Get full text
Year of Publication 06.10.2016
Patent
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY
Salama Islam A, Eid Feras, Lee Kyu Oh, Kong Lay Wai, Zhou Zheng, Oster Sasha N, Soto Gonzalez Javier
Year of Publication 29.09.2016
Get full text
Year of Publication 29.09.2016
Patent
COMPUTATIONAL DATA STORAGE SYSTEMS
MARIA REMIS LUIS CARLOS, MCLERAN DANIEL ROBERT, KEYS JOHN S, ADAMS IAN F, BARCZAK MARIUSZ, RAGHUNATH ARUN, KONG LAY WAI, MESNIER MICHAEL P, ZOU YI
Year of Publication 21.09.2021
Get full text
Year of Publication 21.09.2021
Patent
3D Interconnect Technology
Knickerbocker, John U, Kong, Lay Wai, Niese, Sven, Diebold, Alain, Zschech, Ehrenfried
Published in Advanced Interconnects for ULSI Technology (24.02.2012)
Published in Advanced Interconnects for ULSI Technology (24.02.2012)
Get full text
Book Chapter
Methods of forming sensor integrated packages and structures formed thereby
LEE, KYU OH, OSTER, SASHA N, EID, FERAS, KONG, LAY WAI, SOTO GONZALEZ, JAVIER, ZHOU, ZHENG, SALAMA, ISLAM A
Year of Publication 11.01.2019
Get full text
Year of Publication 11.01.2019
Patent
Methods of forming sensor integrated packages and structures formed thereby
SOTO GONZALEZ JAVIER, KONG LAY WAI, SALAMA ISLAM A, LEE KYU OH, ZHOU ZHENG, OSTER SASHA N, EID FERAS
Year of Publication 28.11.2017
Get full text
Year of Publication 28.11.2017
Patent