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Published in Surface & coatings technology (15.10.2010)
Published in Surface & coatings technology (15.10.2010)
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Performance evaluation of TiAlCrYN nanocomposite coatings deposited using four-cathode reactive unbalanced pulsed direct current magnetron sputtering system
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Published in Vacuum (24.09.2010)
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Structural, mechanical and tribological investigations of sputter deposited CrN―WS2 nanocomposite solid lubricant coatings
DEEPTHI, B, BARSHILIA, Harish C, RAJAM, K. S, KONCHADY, Manohar S, PAI, Devdas M, SANKAR, Jagannathan
Published in Tribology international (01.11.2011)
Published in Tribology international (01.11.2011)
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Structural, mechanical and tribological investigations of sputter deposited CrN-WS sub(2) nanocomposite solid lubricant coatings
Deepthi, B, Barshilia, Harish C, Rajam, K S, Konchady, Manohar S, Pai, Devdas M, Sankar, Jagannathan
Published in Tribology international (01.11.2011)
Published in Tribology international (01.11.2011)
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Structural, mechanical and tribological investigations of sputter deposited CrN–WS 2 nanocomposite solid lubricant coatings
Deepthi, B., Barshilia, Harish C., Rajam, K.S., Konchady, Manohar S., Pai, Devdas M., Sankar, Jagannathan
Published in Tribology international (2011)
Published in Tribology international (2011)
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Structure, morphology and chemical composition of sputter deposited nanostructured Cr–WS 2 solid lubricant coatings
Deepthi, B., Barshilia, Harish C., Rajam, K.S., Konchady, Manohar S., Pai, Devdas M., Sankar, Jagannathan, Kvit, Alexander V.
Published in Surface & coatings technology (2010)
Published in Surface & coatings technology (2010)
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Integrated circuit package with spatially varied solder resist opening dimension
YERUVA SURESH B, CHEN LYNN H, AGRAHARAM SAIRAM, KONCHADY MANOHAR S, OSBORN TYLER N, GARCIA RENEE D, KUMAR SUMIT, ZHENG TIEYU, NARA SRIDHAR
Year of Publication 12.04.2016
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Year of Publication 12.04.2016
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INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPENING DIMENSION
YERUVA SURESH B, CHEN LYNN H, AGRAHARAM SAIRAM, KONCHADY MANOHAR S, OSBORN TYLER N, GARCIA RENEE D, KUMAR SUMIT, ZHENG TIEYU, NARA SRIDHAR
Year of Publication 23.04.2015
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Year of Publication 23.04.2015
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Integrated circuit package with spatially varied solder resist opening dimension
YERUVA SURESH B, CHEN LYNN H, AGRAHARAM SAIRAM, KONCHADY MANOHAR S, OSBORN TYLER N, GARCIA RENEE D, KUMAR SUMIT, ZHENG TIEYU, NARA SRIDHAR
Year of Publication 10.02.2015
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Year of Publication 10.02.2015
Patent
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPENING DIMENSION
YERUVA SURESH B, CHEN LYNN H, AGRAHARAM SAIRAM, KONCHADY MANOHAR S, OSBORN TYLER N, GARCIA RENEE D, KUMAR SUMIT, ZHENG TIEYU, NARA SRIDHAR
Year of Publication 13.11.2014
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Year of Publication 13.11.2014
Patent