Improved thermal management for GaN power electronics: Silver diamond composite packages
Faqir, M., Batten, T., Mrotzek, T., Knippscheer, S., Massiot, M., Buchta, M., Blanck, H., Rochette, S., Vendier, O., Kuball, M.
Published in Microelectronics and reliability (01.12.2012)
Published in Microelectronics and reliability (01.12.2012)
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Journal Article
Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite
FAQIR, M, POMEROY, J. W, COURTADE, F, KUBALL, M, BATTEN, T, MROTZEK, T, KNIPPSCHEER, S, VENDIER, O, ROCHETTE, S, MASSIOT, M, LETTERON, L, DESMARRES, J. M
Published in Journal of microelectronics and electronic packaging (01.04.2013)
Published in Journal of microelectronics and electronic packaging (01.04.2013)
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Journal Article
New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography
FAQIR, M, MANOI, A, MROTZEK, T, KNIPPSCHEER, S, MASSIOT, M, BUCHTA, M, BLANCK, H, ROCHETTE, S, VENDIER, O, KUBALL, M
Published in Journal of microelectronics and electronic packaging (01.07.2011)
Published in Journal of microelectronics and electronic packaging (01.07.2011)
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Journal Article
Silver diamond composite as a new packaging solution: A thermo-mechanical stability study
Faqir, M, Batten, T, Mrotzek, T, Knippscheer, S, Massiot, M, Letteron, L, Rochette, S, Vendier, O, Desmarres, J M, Courtade, F, Kuball, M
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
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Conference Proceeding
Influence of packaging materials on GaN RF power devices
Buchta, M., Thorpe, J., Blanck, H., Beilenhoff, K., Floriot, D., Kuball, M., Mrotzek, T., Knippscheer, S., Courtade, F., Xiong, A.
Published in 2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (01.07.2015)
Published in 2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (01.07.2015)
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Conference Proceeding