Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects
Panchenko, Iuliana, Croes, Kristof, De Wolf, I., De Messemaeker, J., Beyne, Eric, Wolter, Klaus-Juergen
Published in Microelectronic engineering (01.04.2014)
Published in Microelectronic engineering (01.04.2014)
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Journal Article
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
Panchenko, Iuliana, Wolter, Klaus-Juergen, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Beyne, Eric, Wolf, M. Juergen
Published in Microelectronics and reliability (01.11.2019)
Published in Microelectronics and reliability (01.11.2019)
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Journal Article
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
Chen, Hongtao, Mueller, Maik, Mattila, Tonu Tuomas, Li, Jue, Liu, Xuwen, Wolter, Klaus-Juergen, Paulasto-Kröckel, Mervi
Published in Journal of materials research (28.08.2011)
Published in Journal of materials research (28.08.2011)
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Journal Article
Integration of polymer optical waveguides by using flexographic and aerosol jet printing
Reitberger, Thomas, Franke, Joerg, Hoffmann, Gerd-Albert, Overmeyer, Ludger, Lorenz, Lukas, Wolter, Klaus-Juergen
Published in 2016 12th International Congress Molded Interconnect Devices (MID) (01.09.2016)
Published in 2016 12th International Congress Molded Interconnect Devices (MID) (01.09.2016)
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Conference Proceeding
Study of temperature dependent properties of organic substrate materials
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Journal Article
Conference Proceeding
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, Mike, Dudek, Rainer, Wiese, Steffen, Boehme, Bjoern, Wunderle, Berhard, Wolter, Klaus-Juergen, Michel, Bernd
Published in Microelectronics and reliability (01.02.2007)
Published in Microelectronics and reliability (01.02.2007)
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Journal Article
Conference Proceeding
Reliability Testing and Damage Analysis of Lead-Free Solder Joints: New Assessment Criteria for Laboratory Methods
Steller, Antje, Zimmermann, Axel, Eisenberg, Stephan, Wolter, Klaus-Juergen, Lange, Petrik
Published in SAE International journal of materials and manufacturing (01.01.2009)
Published in SAE International journal of materials and manufacturing (01.01.2009)
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Journal Article
Degradations in the silver-filled electrically conductive adhesive joints to a molybdenum electrode after environmental ageing
Ivanov, Vitalii, Wolter, Klaus-Juergen
Published in 2014 International Symposium on Fundamentals of Electrical Engineering (ISFEE) (01.11.2014)
Published in 2014 International Symposium on Fundamentals of Electrical Engineering (ISFEE) (01.11.2014)
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Conference Proceeding
Solder joint inspection with induction thermography
Bohm, Johannes, Wolter, Klaus-Juergen, Heuer, Henning
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
Meier, Karsten, Roellig, Mike, Schiessl, Andreas, Wolter, Klaus-Juergen
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Design and optimization of planar multimode waveguides for high speed board-level optical interconnects
Nieweglowski, Krzysztof, Rieske, Ralf, Sohr, Sebastian, Wolter, Klaus-Juergen
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Environmental ageing effects on the electrical resistance of silver-epoxy electrically conductive adhesive joints to a molybdenum electrode
Ivanov, Vitalii, Wolter, Klaus-Juergen
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Multiphysics investigation of gas sensor packages
Bonasewicz, Robert, Knies, Sonja, Krauss, Andreas, Wolter, Klaus-Juergen
Published in 2015 38th International Spring Seminar on Electronics Technology (ISSE) (01.05.2015)
Published in 2015 38th International Spring Seminar on Electronics Technology (ISSE) (01.05.2015)
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Conference Proceeding
New era in automotive electronics, a co-development by Georgia tech and its automotive partners
Tummala, Rao, Wolter, Klaus-Juergen, Sundaram, Venky, Smet, Vanessa, Raj, Pulugurtha M.
Published in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.01.2016)
Published in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.01.2016)
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Conference Proceeding
Thermosonic platinum wire bonding on platinum
Schulz, Katharina, Ernst, Daniel, Menzel, Siegfried, Gemming, Thomas, Eckert, Juergen, Wolter, Klaus-Juergen
Published in Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (01.05.2014)
Published in Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (01.05.2014)
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Conference Proceeding
Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffraction
Panchenko, Iuliana, Grafe, Juergen, Mueller, Maik, Wolter, Klaus-Juergen
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding