Characterization of TiN films sputter-deposited at low temperatures for Cu-through-silicon via
Sato, Masaru, Kitada, Hideki, Takeyama, Mayumi B.
Published in Japanese Journal of Applied Physics (01.04.2019)
Published in Japanese Journal of Applied Physics (01.04.2019)
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Journal Article
Comparison of endoscopic submucosal resection with ligation and endoscopic submucosal dissection for small rectal neuroendocrine tumors: A multicenter retrospective study
Matsuno, Kenshi, Miyamoto, Hideaki, Kitada, Hideki, Yoshimatsu, Shinichi, Tamura, Fumio, Sakurai, Kouichi, Fukubayashi, Kotaro, Shono, Takashi, Setoyama, Hiroko, Matsuyama, Taichi, Suko, Shinichiro, Narita, Rei, Honda, Munenori, Tateyama, Masakuni, Naoe, Hideaki, Morinaga, Jun, Tanaka, Yasuhito, Gushima, Ryosuke
Published in DEN open (01.04.2023)
Published in DEN open (01.04.2023)
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Journal Article
Advanced wafer thinning technology and feasibility test for 3D integration
Kim, Young Suk, Maeda, Nobuhide, Kitada, Hideki, Fujimoto, Koji, Kodama, Shoichi, Kawai, Akihito, Arai, Kazuhisa, Suzuki, Kousuke, Nakamura, Tomoji, Ohba, Takayuki
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Conference Proceeding
PROSPECTIVE STUDY OF THE EVALUATION OF THE USEFULNESS OF TUMOR TYPING BY NARROW BAND IMAGING FOR THE DIFFERENTIAL DIAGNOSIS OF GASTRIC ADENOMA AND WELL-DIFFERENTIATED ADENOCARCINOMA
Nonaka, Kouichi, Arai, Shin, Ban, Shinichi, Kitada, Hideki, Namoto, Masaaki, Nagata, Koji, Ochiai, Yasutoshi, Togawa, Osamu, Nakao, Masamitsu, Nishimura, Makoto, Ishikawa, Keiko, Sasaki, Yutaka, Kita, Hiroto
Published in Digestive endoscopy (01.04.2011)
Published in Digestive endoscopy (01.04.2011)
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Journal Article
Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
Kitada, Hideki, Maeda, Nobuhide, Fujimoto, Koji, Mizushima, Yoriko, Nakata, Yoshihiro, Nakamura, Tomoji, Ohba, Takayuki
Published in Japanese Journal of Applied Physics (01.05.2011)
Published in Japanese Journal of Applied Physics (01.05.2011)
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Journal Article
Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction
Nakatsuka, Osamu, Kitada, Hideki, Kim, Youngsuk, Mizushima, Yoriko, Nakamura, Tomoji, Ohba, Takayuki, Zaima, Shigeaki
Published in Japanese Journal of Applied Physics (01.05.2011)
Published in Japanese Journal of Applied Physics (01.05.2011)
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Journal Article
Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
Mizushima, Yoriko, Kitada, Hideki, Uchibori, Chihiro J, Maeda, Nobuhide, Kodama, Shoichi, Kim, Youngsuk, Fujimoto, Koji, Yoshimi, Seiichi, Nakamura, Tomoji, Ohba, Takayuki
Published in Japanese Journal of Applied Physics (01.05.2013)
Published in Japanese Journal of Applied Physics (01.05.2013)
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Journal Article
Influence of Titanium Liner on Resistivity of Copper Interconnects
Kitada, Hideki, Suzuki, Takashi, Akiyama, Shinich, Nakamura, Tomoji
Published in Japanese Journal of Applied Physics (01.04.2009)
Published in Japanese Journal of Applied Physics (01.04.2009)
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Journal Article
Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction
Taoka, Noriyuki, Nakatsuka, Osamu, Mizushima, Yoriko, Kitada, Hideki, Kim, Young Suk, Nakamura, Tomoji, Ohba, Takayuki, Zaima, Shigeaki
Published in Japanese Journal of Applied Physics (01.05.2014)
Published in Japanese Journal of Applied Physics (01.05.2014)
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Journal Article
Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad
Tominaga, Shigeru, Abe, Daisuke, Enomoto, Taro, Kondo, Seiichi, Kitada, Hideki, Ohba, Takayuki
Published in Japanese Journal of Applied Physics (01.05.2010)
Published in Japanese Journal of Applied Physics (01.05.2010)
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Journal Article
Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
Kitada, Hideki, Maeda, Nobuhide, Fujimoto, Koji, Mizushima, Yoriko, Nakata, Yoshihiro, Nakamura, Tomoji, Ohba, Takayuki
Published in Japanese Journal of Applied Physics (01.05.2011)
Published in Japanese Journal of Applied Physics (01.05.2011)
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Journal Article
Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction
Nakatsuka, Osamu, Kitada, Hideki, Kim, Youngsuk, Mizushima, Yoriko, Nakamura, Tomoji, Ohba, Takayuki, Zaima, Shigeaki
Published in Japanese Journal of Applied Physics (01.05.2011)
Published in Japanese Journal of Applied Physics (01.05.2011)
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Journal Article
Usefulness of the DL in ME with NBI for determining the expanded area of early-stage differentiated gastric carcinoma
Nonaka, Kouichi, Namoto, Masaaki, Kitada, Hideki, Shimizu, Michio, Ochiai, Yasutoshi, Togawa, Osamu, Nakao, Masamitsu, Nishimura, Makoto, Ishikawa, Keiko, Arai, Shin, Kita, Hiroto
Published in World journal of gastrointestinal endoscopy (16.08.2012)
Published in World journal of gastrointestinal endoscopy (16.08.2012)
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Journal Article
A case of poorly differentiated mucinous carcinoma of the gallbladder that exhibited a peculiar morphology
Urata, Takahiro, Nagamine, Michiko, Kugiyama, Naotaka, Noda, Kana, Ichikawa, Ryo, Takeguchi, Masataka, Yoshimoto, Kazuhito, Minami, Nobuhiro, Kitada, Hideki, Takekuma, Yoshi
Published in Nippon Shōkakibyō Gakkai zasshi (2017)
Published in Nippon Shōkakibyō Gakkai zasshi (2017)
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