System-in-package (SIP): challenges and opportunities
Tai, King L.
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
Get full text
Conference Proceeding
Chip-scale modules for high-level integration in the 21st century
Gregus, Jeffrey A., Lau, Maureen Y., Degani, Yinon, Tai, King L.
Published in Bell Labs technical journal (01.07.1998)
Published in Bell Labs technical journal (01.07.1998)
Get full text
Journal Article
Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology
Wang, Michael X., Suzuki, Katsuharu, Dai, Wayne W.-M., Low, Yee L., O'conner, Kevin J., Tai, King L.
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
Get full text
Conference Proceeding
High Q-factor inductors integrated on MCM Si substrates
Zu, L., Yicheng Lu, Frye, R.C., Lau, M.Y., Chen, S.-C.S., Kossives, D.P., Jenshan Lin, Tai, K.L.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.08.1996)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.08.1996)
Get full text
Journal Article
Conference Proceeding
Ultra-Dense: an MCM-based 3-D digital signal processor
Segelken, J.M., Wu, L.J., Lau, M.Y., Tai, K.L., Shively, R.R., Grau, T.G.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1992)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1992)
Get full text
Journal Article
Chip-scale modules for high-level integration in the 21 super(st) century
Gregus, Jeffrey A, Lau, Maureen Y, Degani, Yinon, Tai, King L
Published in Bell Labs technical journal (01.07.1998)
Get full text
Published in Bell Labs technical journal (01.07.1998)
Journal Article
Silicon multichip modules: evolving a high performance technology from low-end applications
Get full text
Book Review
Journal Article