Cu wiring into nano-scale holes by electrodeposition in supercritical carbon dioxide emulsified electrolyte with a continuous-flow reaction system
Shimizu, Tetsuya, Ishimoto, Yuma, Chang, Tso-Fu Mark, Kinashi, Hikaru, Nagoshi, Takashi, Sato, Tatsuo, Sone, Masato
Published in The Journal of supercritical fluids (01.06.2014)
Published in The Journal of supercritical fluids (01.06.2014)
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