Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package
Kim, Young-Lyong, Lee, Tae-Ik, Kim, Ji-Hye, Kim, Wonsik, Kim, Taek-Soo, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
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